Composite Electronic Component Coating to Prevent Particle Dissolution
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Solution Overview
Problem
Existing electronic components with composite bodies of resin and magnetic metal powder are prone to cracking of the metal film and dissolution of magnetic metal particles when covered with an additional metal film.
Innovation Solution
An electronic component design featuring a composite body with resin and magnetic metal particles, a first metal film with a thickness of 2.9 μm or more on the exposed magnetic metal particles, and a second metal film on top, which suppresses the dissolution of magnetic metal particles by preventing pinholes in the first metal film.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a metal film is formed on the composite body containing magnetic metal particles, then the electronic component achieves proper electrical connection and protection, but pinholes appear in the metal film causing dissolution of magnetic metal particles
Solution Approach 1:
The patent changes the film thickness parameter of the first metal film to 2.9 μm or more, which fundamentally alters the deposition process outcome. This parameter change ensures complete coverage of magnetic metal particles while maintaining pinhole-free structure, preventing particle dissolution without requiring additional protective layers
Solution Approach 2:
The first metal film acts as an intermediary layer between the composite body and the second metal film. By controlling its thickness to 2.9 μm or more, it serves as an effective barrier that prevents harmful interactions (dissolution) between the magnetic metal particles and the plating solution, while still allowing the second metal film to be formed properly
2Reliability
If the first metal film thickness is increased to prevent pinholes, then magnetic metal particle dissolution is suppressed, but manufacturing cost and process complexity increase
Solution Approach 1:
By establishing a clear quantitative threshold (2.9 μm or more) for the first metal film thickness, the patent simplifies the manufacturing process decision-making. Instead of requiring complex multi-layer structures or additional process steps, the solution lies in controlling a single parameter within a defined range, making the process both reliable and manageable
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents pinholes in the first metal film, thereby suppressing the dissolution of magnetic metal particles and ensuring the electronic component maintains good performance.
Implementation Method 1
forming a first metal film on the exposed surface by electroless plating such that a film thickness of the first metal film is 2.9 μm or more
Data Source
AI summary
An electronic component includes a composite body containing resin and magnetic metal particles, a first metal film provided on an outer surface of the composite body, and a second metal film provided on the first metal film. At least one of the magnetic metal particles is exposed at a contact surface of the composite body that is in contact with the first metal film. The first metal film is in contact with an exposed surface of the at least one of the magnetic metal particles exposed from the contact surface. The film thickness of the first metal film on the exposed surface is 2.9 μm or more.