Composite Component Thermal Dissipation via Segmented Bonding
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Solution Overview
Problem
Current composite components used in high-power electrical circuits face challenges with heat dissipation due to thermally conductive adhesives, which are bottlenecks under pulse loads, and solder connections are prone to failure under thermomechanical stress, limiting their service life and application scope.
Innovation Solution
A composite component design featuring two joining layers with an intermediate layer, where at least one layer is a sintered metallic layer, and optionally an adhesive or solder layer, to ensure electrical, mechanical, and thermal connections, with a low thermal expansion coefficient intermediate layer to enhance thermal shock resistance and heat dissipation, and incorporating fluid channels for enhanced cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If thermally conductive adhesive is used to connect the circuit carrier to the heat sink, then the connection is mechanically stable, but heat dissipation is significantly bottlenecked even under short pulse loads
Solution Approach 1:
The bonding interface is segmented into multiple functional layers: a first bonding layer for mechanical bonding, a thermally conductive intermediate layer for heat dissipation, and a second bonding layer for additional bonding. This segmentation allows each layer to optimize for its specific function, resolving the contradiction between mechanical stability and heat dissipation efficiency.
Solution Approach 2:
The patent uses composite material structure with at least one metallic sintered layer having high thermal conductivity (≥100 W/mK) combined with bonding layers. This composite approach enables simultaneous achievement of strong mechanical bonding and efficient heat dissipation, overcoming the limitations of single-material adhesive solutions.
2Loss of energy
If solder material is used to connect the circuit carrier to the heat sink, then thermal conductivity is improved, but thermomechanical stress during operation causes solder deterioration and connection failure
Solution Approach 1:
The patent changes the material parameters of the bonding layers, using metallic sintered layers with thermal conductivity of at least 100 W/mK and controlled thickness (0.01-0.5 mm). These parameter optimizations provide both high thermal conductivity and improved resistance to thermomechanical stress, eliminating the reliability issues of conventional solder while maintaining thermal performance.
Solution Approach 2:
The intermediate layer acts as a mediator between the circuit carrier and heat sink, providing a thermally conductive pathway that is also mechanically resilient. This intermediate metallic sintered layer transfers heat efficiently while accommodating thermomechanical stresses, preventing the connection failures that occur with direct solder connections.
3Device complexity
If a single bonding layer is used to connect joining partners, then the structure is simple, but thermal shock resistance and heat dissipation are insufficient under high power conditions
Solution Approach 1:
The bonding interface is segmented into multiple functional layers: a first bonding layer for mechanical bonding, a thermally conductive intermediate layer for heat dissipation, and a second bonding layer for additional bonding. This segmentation allows each layer to optimize for its specific function, resolving the contradiction between mechanical stability and heat dissipation efficiency.
Solution Approach 2:
The patent uses composite material structure with at least one metallic sintered layer having high thermal conductivity (≥100 W/mK) combined with bonding layers. This composite approach enables simultaneous achievement of strong mechanical bonding and efficient heat dissipation, overcoming the limitations of single-material adhesive solutions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides improved thermal shock resistance and efficient heat dissipation, allowing for reliable operation in high-temperature applications with reduced mechanical stress and increased cooling efficiency.
Implementation Method 1
The heat dissipated by the semiconductor of the electrical circuit is conducted through the circuit carrier and the thermally conductive adhesive forming the bonding point into a base plate or housing to dissipate heat
Implementation Method 2
the intermediate layer is selected such that its coefficient of thermal expansion is low, thereby optimizing the thermal shock resistance of the composite component
Implementation Method 3
The base plate or housing, in turn, can be cooled passively or actively, particularly by a flowing medium
Data Source
Figure 1~3
Figure 4~6
AI summary
The invention relates to a composite component (1) having a first joining partner (2), having at least a second joining partner (3) and having a first joining layer (4) arranged between the first joining partner (2) and the second joining partner (3). According to the invention, there is at least one second joining layer (6) between the first and the second joining partners (2, 3) in addition to the first joining layer (4) and at least one intermediate layer (5) is arranged between the first and the second joining layer (4, 6).