Composite Conductive Ink for Low-Temperature Sintering

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Solution Overview

Problem

Current methods for forming conductive patterns on substrates, such as photosensitive paste and photolithography, face challenges in precision control, high costs, environmental contamination, and require high sintering temperatures, limiting the efficiency and conductivity of the resulting conductive patterns.

Innovation Solution

A method involving the sequential discharge of a conductive inorganic composition with inorganic metal particles and a conductive organic composition with organic metal complexes on a substrate, followed by sintering at a lower temperature, to create a conductive pattern with high conductivity, using inkjet printing technology.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the concentration of metal particle in conductive ink composition is increased to improve conductivity, then conductivity is improved, but dispersion property deteriorates and stability of conductive ink composition worsens

Engineering Contradiction:

ImproveconductivityVSAvoidstability of conductive ink composition

Core Design Contradiction:

ReliabilityVSStability of the object's composition

Solution Approach 1:

The patent uses a composite conductive ink composition containing both inorganic metal particles (for conductivity) and organic metal complexes (for dispersion and stability). The organic metal complexes act as dispersants that prevent aggregation of inorganic metal particles, allowing high metal content while maintaining ink stability and dispersion properties.

Inventive Principle:

Principle #40Composite materials

2Temperature

If the size of inorganic metal particle is reduced to lower sintering temperature, then sintering temperature is lowered, but the conductivity enhancement is limited and processing becomes more difficult

Engineering Contradiction:

Improvesintering temperatureVSAvoidease of processing

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

The patent combines inorganic metal particles (for conductivity) with organic metal complexes that decompose at low temperatures to form conductive pathways. This composite approach enables low-temperature sintering (below 200°C) while achieving good conductivity, as the organic component facilitates conductive network formation at lower temperatures compared to inorganic particles alone.

Inventive Principle:

Principle #40Composite materials

3Manufacturing precision

If conventional methods (photosensitive paste or photolithography) are used to form conductive patterns, then conductive patterns can be formed, but manufacturing precision and control of pitch and width are poor

Engineering Contradiction:

Improveprecision of pitch and widthVSAvoidcomplexity of process

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent replaces conventional mechanical printing methods (screen printing, photolithography) with inkjet printing technology. This substitution enables precise control of conductive pattern dimensions and pitch through digital control of droplet ejection, achieving manufacturing precision without complex mechanical alignment and masking processes.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

4Productivity

If inkjet printing is used to form conductive patterns, then printing time is reduced and environmental contamination is minimized, but achieving high conductivity at low sintering temperature is difficult

Engineering Contradiction:

Improveprinting timeVSAvoidconductivity at low sintering temperature

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The patent formulates a composite conductive ink containing inorganic metal particles and organic metal complexes specifically designed for inkjet printing. The organic metal complexes serve as both conductive precursors and dispersants, enabling the ink to achieve high conductivity after low-temperature sintering while maintaining the advantages of inkjet printing (fast printing, no mask, low contamination).

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables the production of conductive patterns with high conductivity at lower sintering temperatures, reducing costs and simplifying processes, while maintaining precision and minimizing environmental impact.

Implementation Method 1

sintering the conductive inorganic composition and the conductive organic composition

Methodology Applied

Scientific EffectSintering: Sintering

Data Source

PatentUS9578752B2Method of forming conductive pattern and substrate having conductive pattern manufactured by the same method

Publication Date: 2017.02.21 LG CHEM LTD

AI summary

The present invention relates to a method for manufacturing a board that includes a conductive pattern, which comprises the steps of 1) discharging a conductive inorganic composition that includes a conductive inorganic metal particle on a substrate; 2) discharging a conductive organic composition that includes a conductive organic metal complex on the conductive inorganic composition; and 3) sintering the conductive inorganic composition and the conductive organic composition, and a board that includes a conductive pattern manufactured by using the same. A board that includes a conductive pattern according to the present invention may have high conductivity even though it is sintered at a lower sintering temperature than a board that includes a conductive pattern formed by using only an organic material or only an inorganic material.