Composite Conductive Pillar Structure for Thermal Expansion Control
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Solution Overview
Problem
The poor performance of semiconductor structures due to unnecessary extrusion caused by the thermal expansion of conductive pillars, which have a large coefficient of thermal expansion and differ significantly from adjacent structures.
Innovation Solution
Incorporating embedded blocks with a lower coefficient of thermal expansion than the conductive pillars within the semiconductor structure, thereby reducing the overall coefficient of thermal expansion and minimizing extrusion effects on adjacent structures when heated.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductive pillars with high electrical conductivity are used, then electrical performance is improved, but thermal expansion causes extrusion on adjacent structures
Solution Approach 1:
The conductive pillar is constructed as a composite structure containing a core material and an embedded block material with different thermal expansion coefficients. This composite design allows the pillar to maintain high electrical conductivity while the embedded block compensates for thermal expansion, reducing extrusion on adjacent structures.
Solution Approach 2:
The invention utilizes materials with different thermal expansion coefficients arranged in a composite structure. The embedded block material has a thermal expansion coefficient that compensates for the core material's expansion, creating a balanced composite that minimizes overall thermal expansion and associated extrusion effects.
2Reliability
If conductive pillars are heated, then electrical conductivity is maintained, but thermal expansion causes deformation and stress
Solution Approach 1:
The conductive pillar uses a composite structure with core and embedded block materials that together maintain electrical conductivity while providing thermal stability. The differential thermal expansion properties of the composite materials reduce internal stress and deformation during heating cycles.
Solution Approach 2:
The invention changes the physical parameters of the conductive pillar by incorporating materials with specific thermal expansion coefficients. This parameter optimization allows the structure to maintain dimensional stability and reduce stress during temperature variations while preserving electrical conductivity.
3Object-affected harmful factors
If embedded blocks are added to reduce thermal expansion, then extrusion effect is reduced, but manufacturing process becomes more complex
Solution Approach 1:
The conductive pillar is segmented into distinct regions: a core material region and an embedded block material region. This segmentation allows each material to be optimized for its specific function (electrical conductivity and thermal expansion compensation) while being manufactured through a structured multi-step process that manages complexity.
Solution Approach 2:
The embedded block is formed in the through-hole before the core material is deposited. This preliminary action allows the low thermal expansion material to be in place to compensate for future thermal expansion, while the manufacturing process is organized to handle the added complexity in a systematic sequence.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of embedded blocks with a lower thermal expansion coefficient reduces the extrusion effect on adjacent structures, enhancing the stability and performance of semiconductor structures by minimizing thermal stress and deformation.
Implementation Method 1
a coefficient of thermal expansion of the embedded block being less than that of the conductive pillar
Data Source
AI summary
A conductive structure includes: a conductive pillar and at least one embedded block arranged in the conductive pillar, a coefficient of thermal expansion of the embedded block being less than that of the conductive pillar. When the conductive pillar is heated and expanded, an extrusion effect of the conductive pillar on a structure adjacent to the conductive pillar can be reduced, thereby improving the performance of the semiconductor structure.