Composite Connection Structure for Thermal Mismatch Relief
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Solution Overview
Problem
Existing connection structures fail to effectively connect members with different linear expansion coefficients or elastic moduli at low temperatures while maintaining high thermal conductivity and reducing deformation and stress due to heat.
Innovation Solution
A connection structure utilizing a highly heat-resistant resin material, a carbon material, and a void layer, which allows for thermal connection between members with high thermal conductivity at room temperature, reducing deformation and stress by using a carbon material with high thermal conductivity and a binder that remains flexible and non-softer even under heat.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional connection structures are used to connect members with different linear expansion coefficients, then connection is achieved, but thermal conductivity is insufficient and deformation/stress increases under heat
Solution Approach 1:
The connection member uses a composite structure combining heat-resistant resin material with high thermal conductivity filler particles (such as metal particles, ceramic particles, or carbon particles). This composite material simultaneously provides heat resistance to maintain structural integrity and high thermal conductivity to efficiently transfer heat, resolving the contradiction between connection stability and thermal performance
Solution Approach 2:
The invention modifies the physical and chemical parameters of the connection member by selecting filler particles with specific properties (high thermal conductivity, heat resistance) and optimizing their concentration and distribution within the resin matrix. This parameter optimization enables the material to maintain dimensional stability while achieving superior thermal conductivity without requiring high-temperature joining processes
2Temperature
If high-temperature joining processes are used to achieve good thermal connection, then thermal conductivity improves, but deformation and stress due to heat increase
Solution Approach 1:
The invention replaces traditional high-temperature joining materials (such as solder or brazing materials) with a heat-resistant resin-based connection member that achieves thermal conduction without requiring high-temperature processing. This substitution eliminates the thermal stress and deformation associated with high-temperature joining while maintaining effective thermal connection
Solution Approach 2:
By changing the processing temperature parameter from high-temperature joining to low-temperature assembly, the invention achieves thermal connection without subjecting the members to excessive heat. The heat-resistant resin material maintains its structural integrity and bonding strength at operating temperatures without requiring high-temperature processing, thereby preventing thermal deformation and stress
3Temperature
If materials with high thermal conductivity are used in the connection member, then thermal conductivity improves, but resistance to heat-induced deformation decreases
Solution Approach 1:
The connection member employs a composite material system where heat-resistant resin material serves as the matrix and high thermal conductivity filler particles (metal, ceramic, or carbon) are dispersed within it. The resin matrix provides dimensional stability and heat resistance, while the filler particles provide high thermal conductivity, achieving both requirements simultaneously through synergistic material combination
Solution Approach 2:
The invention applies different material properties to different components of the connection member: the resin matrix provides heat resistance and structural stability, while the filler particles concentrated in the matrix provide localized high thermal conductivity pathways. This local quality differentiation allows the material to exhibit both heat resistance and high thermal conductivity without compromising either property
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables high thermal conductivity connections between members with different physical characteristics at low temperatures, alleviating deformation and stress caused by heating elements without the need for high-temperature joining processes.
Implementation Method 1
a connection member that connects the first member and the second member. The connection member includes a heat-resistant resin material, a carbon material, and a void layer
Implementation Method 2
members having different physical characteristics such as linear expansion coefficients... different linear expansion coefficients or elastic moduli
Data Source
AI summary
A connection structure includes: a first member; a second member arranged to oppose the first member and made of a material having a coefficient of linear expansion different from that of the first member; and a connection member that connects the first member and the second member with each other. The connection member includes a highly heat-resistant resin material, a carbon material made of carbon atom, and a void layer.