Composite Heat Dissipation Structure With Integrated Antenna Layout

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Solution Overview

Problem

Existing communication antennas in products such as mobile phones are limited by their radiation capacity due to being independently arranged at frames, leading to manufacturing accuracy issues and interference with heat dissipation structures.

Innovation Solution

A composite heat dissipation structure is designed with a grid tape, buffer layer, and ferrite layer stacked in sequence, incorporating a flexible printed circuit board with separate heat dissipation and communication antenna patterns that do not overlap, using materials like polyimide or PET for the substrate and copper foil for conductive layers, ensuring integration and reducing interference.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If communication antennas are independently arranged at frames, then antenna radiation capacity is limited, but manufacturing accuracy and heat dissipation are improved

Engineering Contradiction:

Improveantenna radiation capacityVSAvoidmanufacturing accuracy

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The patent combines the heat dissipation structure and communication antenna into a single integrated flexible printed circuit board. The antenna pattern is formed on the same substrate as the heat dissipation pattern, eliminating the need for separate frame-mounted antennas. This merging approach improves radiation capacity while maintaining manufacturing accuracy through unified production processes.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The flexible printed circuit board serves multiple functions simultaneously: it acts as both a heat dissipation structure and a communication antenna carrier. The conductive layer is configured to provide both thermal conduction pathways and antenna radiation patterns, allowing one component to fulfill multiple roles that previously required separate elements.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Reliability

If communication antennas are independently arranged at frames, then antenna radiation capacity is limited, but heat dissipation structure interference is reduced

Engineering Contradiction:

Improveantenna radiation capacityVSAvoidheat dissipation structure interference

Core Design Contradiction:

ReliabilityVSObject-generated harmful factors

Solution Approach 1:

By merging the antenna and heat dissipation structure into a single integrated design on the flexible printed circuit board, the patent eliminates the harmful interference that occurs when separate structures are placed in close proximity. The unified structure ensures proper spatial separation and electromagnetic isolation between antenna elements while maintaining effective thermal conduction pathways.

Inventive Principle:

Principle #5Merging (Combining)

3Manufacturing precision

If heat dissipation pattern and communication antenna pattern are integrated on the same substrate, then manufacturing accuracy is improved, but pattern interference may occur

Engineering Contradiction:

Improvemanufacturing accuracyVSAvoidpattern interference

Core Design Contradiction:

Manufacturing precisionVSObject-generated harmful factors

Solution Approach 1:

The conductive layer is segmented into distinct functional regions: heat dissipation patterns and antenna patterns. These segmented regions are designed with appropriate spacing and geometric configurations to prevent electromagnetic interference while maintaining manufacturing accuracy. The segmentation allows each pattern type to operate independently without mutual interference.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the flexible printed circuit board are designed with locally optimized properties. The antenna regions have specific trace geometries and spacing for optimal radiation, while the heat dissipation regions have higher copper density and thermal conduction pathways. This local quality differentiation ensures both functions perform optimally without interfering with each other.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The structure achieves both effective heat dissipation and communication functions while maintaining manufacturing accuracy and reducing interference, enhancing the usability and radiation performance of integrated antennas.

Implementation Method 1

a ferrite layer arranged at one side of the flexible printed circuit board facing away from the grid tape

Methodology Applied

Scientific EffectElectromagnetic absorption: Absorption (EM radiation)

Implementation Method 2

The conductive layer has a heat dissipation pattern and a communication antenna pattern

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS12452990B2Composite heat dissipation structure and display apparatus

Publication Date: 2025.10.21 BEIJING BOE TECH DEV CO LTD

AI summary

The composite heat dissipation structure includes a grid tape, a buffer layer and a ferrite layer that are stacked in sequence, and a flexible printed circuit board arranged at one side of the ferrite layer facing the grid tape. The flexible printed circuit board includes a substrate and a conductive layer on at least one side of the substrate. The conductive layer has a heat dissipation pattern and a communication antenna pattern, and an orthographic projection of the heat dissipation pattern on the substrate and an orthographic projection of the communication antenna pattern on the substrate do not overlap each other.