Composite Copper Components with Oxide Layer for Resin Bonding
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Solution Overview
Problem
In conventional processes using the surface profile of copper foils, voids can form between the resin substrate and the copper plating layer due to the plating solution's inability to spread into intricate surfaces, leading to issues like circuit delamination or substrate blistering when heated.
Innovation Solution
The development of composite copper components with a copper oxide-containing layer, where the surface of the copper component is bonded to a resin substrate by thermocompression, and the copper component is peeled off to analyze the residue using ATR FT-IR and XPS, demonstrating a reduced signal-to-noise ratio and metal atom detection, indicating effective transfer and adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the copper foil surface is roughened by etching to increase mechanical adhesion strength, then adhesive ability to resin substrate is improved, but the surface planarity deteriorates causing increased transmission loss and reduced wiring density
Solution Approach 1:
The invention changes the chemical state of the copper surface by controlling oxidation and reduction processes. The copper surface is oxidized to form copper oxide protrusions, then selectively reduced to create a surface with controlled roughness that maintains both adhesion strength and planarity for high-frequency applications
Solution Approach 2:
The invention creates a composite surface structure on the copper foil consisting of copper metal and copper oxide phases. This composite structure provides both mechanical interlocking for adhesion and controlled surface properties for signal transmission, resolving the contradiction between roughness and planarity
2Strength
If protrusions are formed on copper foil surface to enhance mechanical adhesive strength, then adhesion to resin is improved, but the protrusions tend to fall off or break due to shortage of strength
Solution Approach 1:
The invention changes the chemical composition and mechanical properties of the protrusions by controlling the oxidation state. The copper oxide-containing layer provides a softer, more compliant structure that maintains strong mechanical interlocking with the resin while reducing stress concentration that causes breakage
Solution Approach 2:
The copper oxide layer acts as an intermediary between the copper substrate and the resin. It provides a compliant interface that absorbs stress and prevents direct stress transfer to the copper-protrusion roots, thereby preventing breakage while maintaining adhesion
3Reliability
If plating is applied to protrusion surface to increase strength, then protrusion durability is improved, but the plating solution cannot spread into intricate concavities and convexities creating voids
Solution Approach 1:
The invention changes the surface chemistry by oxidizing the copper to form copper oxide, which has different wetting properties than metallic copper. This allows plating solutions to spread more uniformly into the surface profile without creating voids, while the copper oxide layer provides adequate mechanical strength
4Strength
If the copper foil surface is highly roughened to maximize adhesion, then mechanical adhesion strength is improved, but voids form between resin substrate and copper plating layer leading to delamination and blistering
Solution Approach 1:
The invention optimizes the surface profile parameters by controlling the oxidation and reduction processes to create a moderate roughness level. This provides sufficient mechanical interlocking for adhesion while allowing plating solutions to access and fill all surface cavities, preventing void formation and subsequent delamination or blistering
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures that the copper oxide-containing layer is effectively transferred to the resin substrate, reducing the likelihood of void formation and enhancing the bonding strength between the resin substrate and the copper plating layer, thus preventing delamination and blistering.
Implementation Method 1
a copper foil is pre-conditioned and immersed in a chemical solution containing an oxidizing agent, thereby oxidizing the surface of the copper foil to form protrusions of copper oxide
Implementation Method 2
then immersed in a chemical solution containing a reducing agent, thereby reducing the copper oxide to adjust the protrusions and tune the roughness of the surface
Implementation Method 3
when the surface of the composite copper component is bonded to a resin substrate by thermocompression under given conditions
Data Source
AI summary
The present invention is directed to provide novel composite copper components. For example, provided is a composite copper component including a copper oxide-containing layer formed on at least a portion of the surface of a copper component, in which when the surface of the composite copper component is bonded to a resin substrate by thermocompression, and the copper component is peeled off from the resin substrate after the thermocompression bonding, metal contained in the copper oxide-containing layer is transferred to the resin substrate.