Composite Current Collector Structure to Prevent Tape Breakage
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Solution Overview
Problem
Current battery technologies face challenges in processing performance due to the low structural strength and high deformation of support layers in composite current collectors, leading to issues like tape breakage and poor processing efficiency.
Innovation Solution
Incorporating a support structure within the insulating base of the current collector, made of materials like aluminum, copper, or high-performance fibers, to enhance the structural strength and reduce the gap in deformation between the support and conductive layers, thereby improving processing performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a support layer is used in the current collector, then the insulating performance is improved, but the structural strength is insufficient leading to tape breakage during processing
Solution Approach 1:
The patent applies composite materials by combining an insulating base (polymer material) with a support structure made of conductive materials (metal foil, metal mesh, or conductive fibers). This composite structure integrates the insulating properties of the polymer base with the mechanical strength of the support structure, resolving the contradiction between insulating performance and structural strength.
Solution Approach 2:
The support structure is selectively embedded within the insulating base at specific locations where additional strength is needed. This local reinforcement approach maintains the overall insulating performance while providing targeted structural support to prevent tape breakage during processing, addressing the strength deficiency without compromising insulation.
2Strength
If the support layer strength is increased, then tape breakage is reduced, but the deformation difference between support layer and conductive layer increases
Solution Approach 1:
The patent carefully controls the parameters of the support structure including its material composition, thickness (0.1-5.0 μm), and embedding depth within the insulating base. By optimizing these parameters, the support structure provides necessary strength while maintaining deformation compatibility with the conductive layer, thus reducing manufacturing precision issues.
Solution Approach 2:
The support structure is strategically positioned and dimensioned within the insulating base to provide localized reinforcement without creating excessive rigidity. This localized approach allows the support layer to maintain appropriate flexibility and deformation characteristics that match the conductive layer, preventing manufacturing precision problems.
3Strength
If a support structure is embedded in the insulating base, then the overall strength is improved, but the device complexity increases
Solution Approach 1:
The support structure serves multiple functions simultaneously: it provides mechanical strength to prevent tape breakage, maintains structural integrity during processing, and in some embodiments provides additional conductivity pathways. This multi-functionality reduces the need for separate components, thereby managing complexity while improving strength.
Solution Approach 2:
The support structure is nested within the insulating base, creating a compact integrated structure. This nesting approach combines multiple functional elements (insulation and support) into a single integrated component, improving overall strength while minimizing the increase in device complexity through space-efficient design.
Data Source
AI summary
The present application provides a current collector, electrode plate, cell, battery, device, manufacturing method, and apparatus. The current collector includes a conductive layer and a support layer, wherein the conducive layer is provided on a surface of the support layer, and the support layer includes an insulating base and a support structure embedded in the insulating base to enhance strength of the support layer, which not only increases an overall strength of the current collector and can improve the problem of tape breakage during processing, but also allows strength of the support layer to be close to strength of the conductive layer, narrowing the gap in structural strength between the support layer and the conductive layer, and reducing the difference in deformation between the conductive layer and the support layer during processing, so that it is conducive to improving processing performance of the current collector.