Composite Deposition Mask Structure for High-Resolution Rigidity
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Solution Overview
Problem
The existing deposition masks used in manufacturing high-resolution organic light emitting diode on silicon (OLEDoS) display panels are prone to breakage due to their thin thickness, which compromises their rigidity and durability.
Innovation Solution
A deposition mask is manufactured by depositing a first inorganic layer on a substrate, followed by a second inorganic layer with grooves filled with an insulating layer, and a photoresist pattern is used to etch the substrate, enhancing the mask's rigidity and reducing damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a thin mask membrane is used to achieve high-resolution patterning, then manufacturing precision is improved, but the mask becomes prone to breakage due to reduced rigidity
Solution Approach 1:
The mask structure is designed as a composite system combining a thin mask membrane (for high-resolution patterning) with a rigid support substrate (for mechanical strength). The mask membrane is suspended over openings in the substrate, creating a composite structure that achieves both thinness for precision and substrate support for rigidity, resolving the contradiction between membrane thickness and mask strength
Solution Approach 2:
The solution transitions from a single-dimensional thin membrane to a three-dimensional suspended structure with vertical height above the substrate. This dimensional change allows the mask membrane to maintain its thinness for high-resolution patterning while the vertical suspension over substrate openings provides structural support and rigidity, preventing breakage
2Strength
If the mask membrane thickness is increased to improve rigidity, then mask strength is improved, but the resolution capability for high-PPI display manufacturing deteriorates
Solution Approach 1:
The mask structure is segmented into two functional components: a thin mask membrane layer (for high-resolution patterning capability) and a separate rigid substrate (for mechanical support). This segmentation allows each component to be optimized independently - the membrane remains thin for resolution while the substrate provides strength, avoiding the need to increase overall membrane thickness
3Device complexity
If a single-layer inorganic mask membrane is used to simplify manufacturing, then device complexity is reduced, but the mask is more susceptible to damage
Solution Approach 1:
The mask is designed as a composite structure with a thin inorganic mask membrane suspended over a rigid substrate with openings. This composite architecture provides the thin membrane for simplicity and deposition functionality while the substrate provides mechanical durability and damage resistance, resolving the contradiction between structural simplicity and reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method increases the mask's rigidity, reducing the risk of breakage and ensuring the production of high-resolution display panels without compromising structural integrity.
Implementation Method 1
forming a coating layer covering the entire surface of the substrate and the entire surface of the mask membrane using the atomic layer deposition (ALD) method
Data Source
AI summary
A deposition mask and a method of manufacturing a deposition mask includes depositing a first inorganic layer on a substrate, depositing a second inorganic layer on the first inorganic layer, forming a plurality of grooves in the second inorganic layer, and filling the plurality of grooves with an insulating layer, forming a photoresist pattern including a plurality of first openings corresponding to a cell opening on the second inorganic layer, etching the second inorganic layer at a periphery of the plurality of grooves using the photoresist pattern as a mask and exposing the cell opening by etching the substrate and the first inorganic layer from a downward direction facing a rear surface of the substrate.


