Composite Semiconductor-on-Diamond Wafer Handling

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Solution Overview

Problem

Thin semiconductor-on-diamond wafers are challenging to handle and process in standard semiconductor manufacturing lines due to their fragility, bowing, and rough surfaces, which makes them unsuitable for commercial foundry processing.

Innovation Solution

A composite wafer structure is created by bonding a thin semiconductor-on-diamond wafer to a thicker diamond handle wafer using a low-expansion ceramic adhesive, allowing for improved mechanical stability and thermal matching, enabling robust handling and processing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If thin semiconductor-on-diamond wafers are used for thermal management, then thermal conductivity is improved, but mechanical stability and ease of handling deteriorate

Engineering Contradiction:

Improvethermal conductivityVSAvoidmechanical stability

Core Design Contradiction:

TemperatureVSStability of the object's composition

Solution Approach 1:

The patent combines a thin semiconductor-on-diamond wafer with a thicker diamond handle wafer to create a composite structure. This merging allows the thin wafer to provide excellent thermal conductivity while the thicker handle wafer provides the necessary mechanical stability and rigidity for handling and processing.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The invention creates a composite wafer structure consisting of two diamond wafers bonded together with different thicknesses. The composite structure integrates the thermal management benefits of thin wafers with the mechanical advantages of thick wafers, resolving the contradiction between thermal performance and mechanical stability.

Inventive Principle:

Principle #40Composite materials

2Temperature

If thin semiconductor-on-diamond wafers are used, then thermal management performance is improved, but ease of operation in standard manufacturing lines deteriorates

Engineering Contradiction:

Improvethermal management performanceVSAvoidease of handling

Core Design Contradiction:

TemperatureVSEase of operation

Solution Approach 1:

By merging the thin semiconductor-on-diamond wafer with a thicker diamond handle wafer, the composite structure provides the thermal management performance of the thin wafer while the thicker handle portion provides the mechanical rigidity needed for easy handling and operation in standard manufacturing lines.

Inventive Principle:

Principle #5Merging (Combining)

3Temperature

If thin semiconductor-on-diamond wafers are used, then thermal resistance is reduced, but manufacturing precision requirements increase

Engineering Contradiction:

Improvethermal resistanceVSAvoidbow and surface roughness control

Core Design Contradiction:

TemperatureVSManufacturing precision

Solution Approach 1:

The composite wafer structure merges a thin semiconductor-on-diamond wafer with a thicker handle wafer. The thin wafer layer provides low thermal resistance while the thicker handle wafer provides structural support that reduces bow and controls surface roughness, thereby meeting manufacturing precision requirements.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The composite structure uses two diamond wafers of different thicknesses bonded together, allowing the thin layer to optimize thermal performance while the thick layer optimizes mechanical properties and surface flatness, reducing the need for precise control of the thin wafer alone.

Inventive Principle:

Principle #40Composite materials

4Temperature

If diamond wafer thickness is reduced for thermal management, then thermal performance is improved, but reliability during processing deteriorates

Engineering Contradiction:

Improvethermal performanceVSAvoidreliability during processing

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The patent merges a thin semiconductor-on-diamond wafer with a thicker diamond handle wafer. The thin wafer provides excellent thermal performance while the thicker handle wafer provides the mechanical strength and reliability needed to withstand processing conditions, preventing wafer breakage and deformation.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach allows for practical handling and processing of thin semiconductor-on-diamond wafers, reducing bow and surface roughness issues, making them acceptable for industrial processing and extending the life of the diamond handle wafer for reuse.

Implementation Method 1

Methodology Applied

Scientific EffectThermal expansion matching: Thermal Expansion

Data Source

PatentEP2870626B1Composite wafer comprising temporary handle wafer and semiconductor-on-diamond wafer and method of manufacture

Publication Date: 2021.06.23 RFHIC CORP

Figure 1
Figure 2A~2B
Figure 2C

AI summary

Methods for mounting and dismounting thin and/or bowed semiconductor-on-diamond wafers (401) to a carrier (407) are disclosed that flatten said wafers and provide mechanical support to enable efficient semiconductor device processing on said semiconductor- on-diamond wafers.