Composite Die Attach Film Structure for Semiconductor Heat Dissipation

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Semiconductor chips bonded with conventional die attach films have low thermal conductivity, leading to inefficient heat dissipation.

Innovation Solution

A die attach film structure comprising a stack of insulating and conductive adhesion layers with specific fillers, such as alumina and silver particles, to enhance thermal conductivity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a conventional die attach film is used to bond semiconductor chips, then the bonding function is achieved, but thermal conductivity is low leading to inefficient heat dissipation

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidthermal management performance

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The die attach film uses a composite structure with insulating adhesion layers containing insulating fillers (such as glass beads or ceramic particles) and conductive adhesion layers containing conductive fillers (such as metal particles). This composite material design enables simultaneous achievement of electrical insulation and enhanced thermal conductivity, resolving the contradiction between bonding function and heat dissipation efficiency

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The die attach film is designed with spatially varying properties: insulating adhesion layers are positioned in regions requiring electrical isolation, while conductive adhesion layers are positioned in regions requiring heat dissipation. This local differentiation of material properties allows the film to simultaneously satisfy both electrical insulation requirements and thermal management requirements in different areas

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The die attach film structure achieves increased thermal conductivity, improving heat emission and dissipation characteristics in semiconductor packages.

Implementation Method 1

a conductive adhesion layer contacting the upper surface of the insulating adhesion layer and comprising a conductive filler

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

an insulating adhesion layer comprising an upper surface and a lower surface opposite the upper surface, the lower surface of the insulating adhesion layer contacting an upper surface of the dicing film and the insulating adhesion layer comprising an insulating filler

Methodology Applied

Scientific EffectElectrical insulation: Dielectric

Data Source

PatentUS20260047392A1Die attach film structure and semiconductor package including the same

Publication Date: 2026.02.12 SAMSUNG ELECTRONICS CO LTD

AI summary

A die attach film structure includes a dicing film, an insulating adhesion layer including an upper surface and a lower surface opposite the upper surface, the lower surface of the insulating adhesion layer contacting an upper surface of the dicing film and including an insulating filler, and a conductive adhesion layer contacting an upper surface of the insulating adhesion layer and including a conductive filler.