Composite Die-Coat for Thermal Stress Buffering in Packages
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Solution Overview
Problem
Current die-coat materials fail to provide both effective thermal conductivity and efficient stress buffering, leading to interfacial thermomechanical stress issues in devices, particularly at high temperatures, resulting in mechanical degradation and failures such as cracks and delamination.
Innovation Solution
A hybrid composite coating material incorporating a polymer matrix with hexagonal boron-nitride (h-BN) particles or other ceramic fillers, which reduces interfacial stress and heat localization, thereby mitigating failures during high-temperature operations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional die-coat materials are used, then the device structure is simple and manufacturing is easy, but thermal conductivity is insufficient and stress buffering is limited
Solution Approach 1:
The patent applies composite materials by combining polymer matrices with ceramic particles (such as aluminum oxide, aluminum nitride, or silicon nitride) to create a die-coat that simultaneously provides mechanical flexibility for stress buffering and high thermal conductivity for heat dissipation. This composite structure resolves the contradiction by integrating multiple material properties into a single coating system.
2Reliability
If conventional die-coat materials are used, then the coating application is simple, but thermal conductivity and stress buffering cannot be achieved simultaneously
Solution Approach 1:
The patent employs parameter changes by adjusting the concentration, size distribution, and shape of ceramic particles within the polymer matrix to optimize both thermal conductivity and stress buffering properties. By controlling particle parameters (size, shape, concentration) and polymer matrix composition, the coating achieves enhanced thermal management while maintaining manufacturability through standardized processing techniques.
3Reliability
If conventional die-coat materials are used, then the device is easier to manufacture, but interfacial thermomechanical stress causes cracks and delamination at high temperatures
Solution Approach 1:
The composite coating structure combines a polymer matrix providing stress compliance with ceramic particles providing thermal conductivity and structural stability. This composite architecture enables the coating to withstand high-temperature thermal cycling without cracking or delaminating, as the polymer matrix accommodates thermal expansion differences while the ceramic network maintains structural integrity and heat dissipation.
Solution Approach 2:
The patent applies local quality by creating regions with different ceramic particle concentrations and sizes within the coating. Areas closer to the die surface may have higher ceramic content for thermal management, while other regions may have more polymer matrix for stress compliance. This spatial variation in composition optimizes both thermal conductivity and stress buffering locally throughout the coating structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The hybrid composite coating significantly reduces failures associated with interfacial stress and heat dissipation issues, enhancing the reliability of devices under high-temperature conditions like thermal cycling and reverse bias testing.
Implementation Method 1
The composite coating material includes a polymer matrix including and/or incorporating ceramic particles
Implementation Method 2
A hybrid composite coating material incorporating a polymer matrix with hexagonal boron-nitride (h-BN) particles or other ceramic fillers, which reduces interfacial stress and heat localization
Data Source
AI summary
A device may include device parts, a composite coating material arranged on one or more of the device parts, and a molding compound arranged on and/or around one or more of the device parts. Moreover, the device may include where the composite coating material may include a polymer matrix including and/or incorporating ceramic particles.