Composite Dummy Wafer Structure for Accurate Infrared Thermal Imaging
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Solution Overview
Problem
Existing dummy wafers fail to accurately simulate the temperature distribution of electronic devices on silicon wafers due to materials that transmit infrared rays, making it difficult to capture accurate temperature images using infrared thermography cameras.
Innovation Solution
A dummy wafer design featuring a planar heater sandwiched between plate-shaped members made of aluminum alloys like A5052 or silicon carbide, which do not transmit infrared rays, allowing for even thermal expansion and heat capacity equivalent to silicon wafers, enabling accurate temperature distribution simulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional dummy wafers are used, then the structure is simple and easy to manufacture, but they fail to accurately simulate temperature distribution because the materials transmit infrared rays
Solution Approach 1:
The dummy wafer employs a composite structure consisting of a silicon carbide substrate combined with an aluminum alloy plate. The silicon carbide portion provides infrared ray blocking capability while the aluminum alloy plate contributes thermal mass and heat capacity, enabling accurate temperature distribution simulation that matches silicon wafer characteristics without transmitting infrared rays.
2Measurement precision
If materials that block infrared rays are used, then accurate temperature imaging is enabled, but the thermal expansion becomes uneven affecting measurement accuracy
Solution Approach 1:
The composite structure of silicon carbide and aluminum alloy is specifically designed to balance infrared blocking with uniform thermal expansion. The silicon carbide layer blocks infrared rays for accurate imaging, while the aluminum alloy plate provides thermal mass that ensures even heat distribution and uniform thermal expansion across the dummy wafer surface.
Solution Approach 2:
The thickness of the aluminum alloy plate is carefully controlled (0.1-0.5mm) to optimize the balance between infrared blocking capability and thermal expansion characteristics. By adjusting this parameter, the dummy wafer achieves both accurate temperature simulation and uniform thermal behavior.
3Measurement precision
If a thick dummy wafer is used to achieve heat capacity equivalent to silicon wafers, then temperature simulation is accurate, but the thickness exceeds the measurement range of infrared thermography cameras
Solution Approach 1:
The dummy wafer uses a composite structure where a thin aluminum alloy plate (0.1-0.5mm) is combined with a silicon carbide substrate. This configuration achieves heat capacity equivalent to silicon wafers while maintaining a total thickness within the measurement range of infrared thermography cameras, solving the contradiction between thermal mass requirements and measurement compatibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the capture of infrared images that simulate the temperature distribution of electronic devices on silicon wafers, facilitating efficient and cost-effective evaluation of temperature distributions without the need for actual semiconductor processes.
Implementation Method 1
a planar heater and a pair of plate-shaped members formed of an aluminum alloy, aluminum, or silicon carbide, wherein the planar heater is sandwiched by the plate-shaped members
Implementation Method 2
materials that transmit infrared rays, making it difficult to capture accurate temperature images using infrared thermography cameras
Implementation Method 3
allowing for even thermal expansion and heat capacity equivalent to silicon wafers
Data Source
AI summary
A dummy wafer includes a planar heater and a pair of plate-shaped members formed of an aluminum alloy, aluminum, or silicon carbide, wherein the planar heater is sandwiched by the plate-shaped members.