Composite Electronic Component Electrode Plating With Exposed Metal Powder
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Solution Overview
Problem
The existing electronic components with outer electrodes formed by thermosetting resin and Ag particles suffer from increased contact resistance, leading to reduced efficiency.
Innovation Solution
The formation of an outer electrode by directly plating on a core made of a composite material with exposed metal powder particles, which creates a network structure for improved conductivity and reduced resistance, using laser irradiation to expose and bond metal powder particles, and applying a plating catalyst for enhanced productivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If outer electrode is formed by applying pastes containing thermosetting resin and Ag particles, then the outer electrode can be formed on the core surface, but the contact resistance of the outer electrode is increased
Solution Approach 1:
The invention extracts and removes the thermosetting resin from the outer electrode structure by laser irradiation, leaving only the conductive metal powder particles. This extraction eliminates the insulating barrier that caused high contact resistance, while the metal powder network structure remains to provide low-resistance conductivity.
Solution Approach 2:
The invention changes the physical and chemical parameters of the core surface through laser irradiation, transforming it from a state with embedded metal powder in resin to a state with exposed and sintered metal powder particles. This parameter change creates a surface with high conductivity and low contact resistance suitable for outer electrode formation.
2Productivity
If metal powder particles are exposed and make contact on the outer surface, then plating deposition speed is improved and low resistance is achieved, but the complexity of the manufacturing process increases
Solution Approach 1:
The invention performs preliminary action by using laser irradiation to expose and sinter the metal powder particles on the core surface before the plating process. This preliminary preparation creates an optimal surface structure that accelerates subsequent plating deposition, improving productivity without requiring complex manufacturing equipment.
Solution Approach 2:
The invention replaces traditional mechanical or chemical methods of creating conductive surfaces with laser irradiation. This substitution provides a more efficient and controllable method for exposing and sintering metal powder particles, achieving low resistance and high plating deposition speed with a relatively simple process.
3Reliability
If laser irradiation is used to expose and bond metal powder particles, then the network structure becomes strong and conductivity is improved, but energy consumption increases
Solution Approach 1:
The invention utilizes phase transitions of the metal powder particles through laser irradiation, melting and sintering them to form strong bonds. This phase transition approach creates a robust network structure with high conductivity while being more energy-efficient than alternative heating or bonding methods.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in easily formed metal films with low resistance, improved voltage endurance, and maintained insulation properties, with the metal powder network structure enhancing plating deposition speed and conductivity on the surface.
Implementation Method 1
irradiating an outer surface of an element body made of a composite material of a resin material and metal powder with laser such that a plurality of particles of the metal powder are exposed from the resin material and make contact with one another
Implementation Method 2
the particles are bonded to one another by being molten
Implementation Method 3
the plurality of particles configure a network structure connected with one another. Accordingly, when the metal film such as the outer electrode is formed by performing plating directly on the element body, an electric current is easy to be supplied with the network structure of the metal powder
Implementation Method 4
the metal film such as the outer electrode is formed by performing plating directly on the element body
Data Source
AI summary
An electronic component includes an element body made of a composite material of a resin material and metal powder. A plurality of particles of the metal powder are exposed from the resin material and make contact with one another on the outer surface of the element.