Composite Electronic Component Reducing Magnetic Field Coupling
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Solution Overview
Problem
The miniaturization of composite electronic components leads to increased magnetic field coupling between lines, making it difficult to design resonant frequencies of resonant circuits to have desired values, particularly in filters and multiplexers.
Innovation Solution
A composite electronic component with a multilayered structure where dielectric and conductor layers are alternately stacked, with specific arrangements of lines and capacitors to reduce magnetic field coupling, such as placing second conductor layers between first and third conductor layers, and overlapping lines with electrodes to minimize coupling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the composite electronic component is miniaturized, then the size of the component is reduced, but the magnetic field coupling between lines increases
Solution Approach 1:
The patent transitions from planar arrangement of lines to a three-dimensional stacked configuration where lines are placed in different dielectric layers. This vertical separation in the Z-direction reduces magnetic field coupling while maintaining miniaturization, as the lines occupy different spatial dimensions rather than merely being closer in the same plane.
Solution Approach 2:
The patent introduces dielectric layers as intermediary structures between the lines. These dielectric layers act as magnetic field shields or barriers that reduce the coupling between adjacent lines, allowing miniaturization without the harmful increase in magnetic interaction.
2Object-affected harmful factors
If lines are arranged to control magnetic field coupling, then magnetic coupling is reduced, but the design complexity of resonant frequency increases
Solution Approach 1:
The patent divides the resonant circuit into separate segments: the line structure and the capacitor structure are physically separated and placed in different dielectric layers. This segmentation allows independent optimization of each component's resonant characteristics, simplifying the overall frequency design process by reducing unwanted coupling effects that would require complex compensatory adjustments.
Solution Approach 2:
The patent applies different dielectric materials or structures to different local regions where lines are positioned. By controlling the local dielectric environment around each line, the resonant frequency can be precisely tuned without affecting other parts of the circuit, thereby simplifying the overall frequency design while maintaining reduced magnetic coupling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This arrangement eases the design of resonant frequencies by reducing magnetic field coupling, allowing for more precise control of attenuation poles and improved transmission characteristics in filters and multiplexers.
Implementation Method 1
the magnetic field coupling between the lines increases... control the magnetic field coupling between the lines of the resonant circuits
Data Source
AI summary
A composite electronic component includes a multilayered body in which a plurality of dielectric layers and a plurality of conductor layers are alternately stacked, a first resonant circuit including a first line and a first capacitor, the first line being formed of one or more first conductor layers of the conductor layers, the first capacitor including a first electrode formed of a plurality of second conductor layers of the conductor layers, and a second resonant circuit including a second line and a second capacitor, the second line being formed of one or more third conductor layers of the conductor layers, the second capacitor including a second electrode formed of the second conductor layers, the second conductor layers being located between the one or more first conductor layers and the one or more third conductor layers.