Composite Electronic Component with Protective Metal Film
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Solution Overview
Problem
Composite electronic components with Ag or Cu upper surface conductors suffer from ion migration issues, leading to deterioration in insulation resistance when exposed to electric fields, as these materials ionize and migrate, reducing their effectiveness.
Innovation Solution
A composite electronic component design where the upper surface conductors, primarily made of Ag or Cu, are covered with a protective metal film containing a metal component with a higher weight ratio than Ag and Cu, such as Sn, Ni, or Au, to prevent ion migration and maintain insulation resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If Ag or Cu is used as the upper surface conductor to obtain sufficient conductivity, then electrical conductivity is improved, but ion migration occurs under electric field causing deterioration in insulation resistance
Solution Approach 1:
The upper surface conductor is constructed as a composite structure with a conductive layer (Ag or Cu) providing electrical conductivity and a protective metal film (Sn, Ni, or Au) preventing ion migration. This composite structure resolves the contradiction by combining materials with complementary properties: the conductive layer maintains low electrical resistance while the protective film acts as a barrier against ion migration under electric fields.
Solution Approach 2:
The protective metal film serves as an intermediary barrier between the conductive layer and the external environment. This intermediate layer prevents direct interaction between the Ag/Cu conductive material and the electric field, thereby blocking the ion migration process while allowing the underlying conductive layer to maintain its electrical function.
2Reliability
If a protective metal film is added to prevent ion migration, then insulation resistance is maintained, but device structure becomes more complex
Solution Approach 1:
The protective metal film is applied as a thin film coating on the conductive layer. This thin film approach provides the necessary protection against ion migration while minimizing the additional structural complexity and maintaining a compact device design. The film thickness is sufficient to prevent ion migration but thin enough to avoid significant structural burden.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The protective metal film effectively prevents ion migration, ensuring high reliability and maintaining insulation resistance between upper surface conductors, thereby enhancing the stability and performance of the composite electronic components.
Implementation Method 1
Ag and Cu are conductive materials that easily cause to a so-called 'ion migration', the problem that under the application of an electric field, they partly ionize and migrate to other position
Data Source
AI summary
A composite electronic component includes a first and second electronic elements, and a joint material. The first electronic element includes a base member, and an upper surface conductor on an upper surface of the base member. The second electronic element includes an element body with a lower surface facing the upper surface of the base member, and a terminal conductor disposed on the lower surface of the element body. The joint material joins the upper surface conductor and the terminal conductor. The upper surface conductor includes a conductive layer in which a metal that is maximum in weight ratio is Ag. The lateral surface of the conductive layer is covered with conductive layers defining a protective metal film, and the metal that is maximum in weight ratio contained in the conductive layers defining a protective metal film is a metal other than Ag and Cu.