Composite Electronic Component Side-End Electrode Mounting
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Solution Overview
Problem
Conventional composite electronic components face challenges in effectively mounting multiple components with different electrical functions on limited spaces in devices like portable telephones and digital cameras, requiring innovative solutions to reduce size and enhance connection reliability.
Innovation Solution
A composite electronic component design featuring a substrate with a conductive pattern extending to its side end, allowing for the efficient mounting of multiple electronic components with external electrodes on a smaller surface area, thereby reducing the space required for mounting and improving connection reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple electronic components are mounted on a substrate, then the electrical functionality is enhanced, but the mounting area increases
Solution Approach 1:
The patent utilizes the side end surface of the substrate as an additional mounting dimension. External electrodes are positioned on both the main surface and the side end surface of the substrate, effectively transitioning from a two-dimensional mounting plane to a three-dimensional mounting structure. This allows multiple electronic components to be mounted in a stacked or adjacent configuration, enhancing electrical functionality while minimizing the footprint on the main surface.
Solution Approach 2:
The patent employs asymmetric positioning of external electrodes, where one electrode is located on the main surface and another is positioned on the side end surface of the substrate. This asymmetric arrangement optimizes space utilization by extending the mounting area into the vertical dimension, thereby reducing the required mounting area on the main surface while maintaining multiple electrical connection points.
2Area of stationary object
If the mounting area is reduced, then the device size is minimized, but the connection reliability may deteriorate
Solution Approach 1:
By extending electrode connections to the side end surface of the substrate, the patent creates multiple spatial paths for electrical connections. This three-dimensional electrode arrangement distributes connection points across different surfaces, reducing the risk of connection failure and enhancing reliability even when the main surface mounting area is minimized.
Solution Approach 2:
The patent combines multiple functions into a single substrate structure that serves as both the mounting platform and the connection medium. The substrate integrates the mechanical support function with the electrical connection function through its multi-surface electrode system, thereby maintaining connection reliability while reducing the overall mounting area required.
Data Source
AI summary
A composite electronic component includes a substrate with a first main surface and a side end surface, a first electronic component including external electrodes and mounted on the first main surface of the substrate, a second electronic component including external electrodes and being different in electrical function from the first electronic component mounted on the first main surface of the substrate, and a conductive pattern on the first main surface of the substrate, electrically connecting the first electronic component and the second electronic component to each other, and including one end reaching a side of one side end of the substrate, one external electrode of the first electronic component and one external electrode of the second electronic component being located on the side of the one side end of the substrate, another external electrode of the first electronic component and another external electrode of the second electronic component being connected to the conductive pattern, and the composite electronic component being mounted such that a surface of the substrate on the side of the one side end is opposed to a first main surface of a mount substrate.