Composite Electronic Device Intermediate Layer Composition
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Solution Overview
Problem
Conventional composite electronic devices face challenges in integrating magnetic and dielectric layers without defects, particularly with SrO—TiO2 or ZnO—TiO2 based oxides, due to material differences and environmental concerns, such as Pb content and diffusion issues, limiting their application and reliability.
Innovation Solution
A composite electronic device with a coil part, capacitor part, and intermediate material layer containing ZnO, TiO2, and boron, where the intermediate material layer has a specific mole and weight composition to form a ZnO—TiO2 compound, allowing for defect-free integration and low-temperature sintering below the melting point of Ag, enhancing reliability and compatibility with various dielectric and magnetic materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional intermediate material layers are used between magnetic and dielectric layers, then integration is achieved, but defects occur due to material incompatibility and diffusion issues
Solution Approach 1:
The patent introduces a specific intermediate material layer composition (ZnO 50-85 parts by mole, TiO2 15-50 parts by mole, B2O3 0.1-5.0 parts by weight) that acts as a mediator between the magnetic layer and dielectric layer. This intermediate layer prevents harmful diffusion while ensuring good integration, resolving the contradiction between achieving integration and avoiding defects.
Solution Approach 2:
The patent precisely controls the compositional parameters of the intermediate material layer, specifying exact ranges for ZnO content (50-85 parts by mole), TiO2 content (15-50 parts by mole), and B2O3 content (0.1-5.0 parts by weight). By optimizing these parameters, the patent achieves both reliable integration and defect-free manufacturing.
2Reliability
If high-temperature sintering is used to integrate layers, then integration is achieved, but Ag conductor material cannot be used due to melting point constraints
Solution Approach 1:
The patent changes the sintering temperature parameter from conventional high temperatures (1000°C or higher) to a lower range (900°C or lower), making it compatible with Ag conductor materials. This is achieved by optimizing the intermediate material layer composition, particularly the B2O3 content (0.1-5.0 parts by weight), which lowers the sintering temperature while maintaining integration reliability.
3Ease of manufacture
If Pb-based dielectric ceramic materials are used, then sintering is achieved, but environmental concerns arise due to Pb content
Solution Approach 1:
The patent extracts and eliminates Pb (lead) from the dielectric ceramic material composition, replacing it with environmentally friendly alternatives. The dielectric layer uses materials free from Pb, Cd, and other harmful substances, while maintaining sintering capability through optimized intermediate material layer composition and processing conditions.
Solution Approach 2:
The patent changes the chemical composition parameters of the dielectric ceramic material to eliminate harmful elements. By adjusting the intermediate material layer composition (particularly B2O3 content) and sintering parameters, the patent achieves successful sintering without requiring Pb-based materials.
4Reliability
If Fe-containing intermediate material layers are used, then integration is achieved, but dielectric ceramic characteristics deteriorate due to Fe diffusion
Solution Approach 1:
The patent extracts and eliminates Fe (iron) from the intermediate material layer composition to prevent diffusion into the dielectric ceramic layer. The intermediate layer uses ZnO, TiO2, and B2O3 instead, which do not cause deterioration of dielectric characteristics while still achieving reliable integration.
Solution Approach 2:
The patent introduces a Fe-free intermediate material layer as a mediator between the magnetic and dielectric layers. This intermediate layer prevents harmful diffusion while ensuring good integration, resolving the contradiction between achieving integration and maintaining dielectric characteristics.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables reliable integration of magnetic and dielectric layers without defects, allowing for low-temperature sintering and improved reliability, while being environmentally friendly by avoiding Pb and minimizing diffusion issues, thus meeting the demand for downsized electronic devices.
Implementation Method 1
it has become possible to sinter at low temperature and to use Ag as a conductor material
Implementation Method 2
there were cases where the coil part and the capacitor part can not be sintered sufficiently integrally due to a difference of material between the coil part and the capacitor part
Data Source
AI summary
Composite electronic including coil, capacitor and intermediate parts, wherein coil part includes coil-conductor and magnetic-layer, capacitor part includes internal electrodes and dielectric-layer, which contains SrO—TiO2 or ZnO—TiO2 based oxide, intermediate part between coil and capacitor parts, intermediate part includes intermediate material layer, which contains ZnO, TiO2 and boron, ZnO contained in intermediate material layer 50-85 parts by mole and TiO2 contained the intermediate material layer 15-50 parts by mole when total content of ZnO and TiO2 in intermediate material layer is 100 parts by mole, content boron in intermediate material layer is 0.1-5.0 parts by weight of B2O3 when total of ZnO and TiO2 in intermediate material layer set to 100 parts by weight, part of ZnO and TiO2 intermediate material layer constitute ZnO—TiO2 compound, which in intermediate material layer is 50 wt % or more when total weight of ZnO and TiO2 in intermediate material layer is set to 100 wt %.