Composite Material Electronic Element Integration
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Solution Overview
Problem
Current methods for integrating electronic elements into composite materials often result in defects such as delamination and mechanical brittleness, as existing solutions are too intrusive and negatively impact the structural quality of the materials, while also being challenging to implement effectively during manufacturing.
Innovation Solution
A method involving the preparation of a first substrate with an electronic element, followed by impregnation with a second substrate to minimize intrusion, allowing for the integration of electronic elements between the substrates, which are then removed to form a composite material with integrated electronic components that maintain the primary functions of the material.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electronic elements are integrated into composite materials using conventional methods, then electronic functions are achieved, but defects such as delamination and mechanical brittleness occur
Solution Approach 1:
The patent extracts the electronic elements from the bulk composite structure and positions them exclusively at the surface of the plies. This extraction eliminates the intrusive integration that causes delamination and mechanical brittleness, while still achieving electronic functions through surface-mounted sensors, antennas, or conductive elements.
Solution Approach 2:
The patent transitions electronic element integration from a three-dimensional bulk integration approach to a two-dimensional surface placement approach. By confining electronic elements to the surface dimension, the method avoids disrupting the internal composite structure, thereby preventing delamination and maintaining mechanical integrity.
2Adaptability or versatility
If flexible substrates are employed to increase flexibility of composite structures, then flexibility is improved, but structural quality may be compromised
Solution Approach 1:
The patent employs flexible substrates as the base medium for mounting electronic elements on the ply surface. These thin film substrates provide the necessary flexibility for adapting composite structures to curved or deformable applications, while their thin profile minimizes intrusion into the composite structure, preserving structural quality.
3Productivity
If electronic elements are integrated during manufacturing, then productivity is improved, but manufacturing complexity increases
Solution Approach 1:
The patent prepares the electronic elements and their mounting substrates in advance, before the composite manufacturing process. Electronic elements are pre-mounted on flexible substrates or pre-fabricated circuits, which are then simply placed on the ply surface during manufacturing. This preliminary preparation simplifies the main manufacturing process while maintaining high integration efficiency.
Data Source
AI summary
A method of manufacturing a composite material including at least one ply integrating at least one electronic element situated at the surface of the ply. Also, materials obtained thereof and devices including such materials. The method includes: a) preparing or providing a first substrate having at least one layer; b) applying at least one electronic element onto a face of the first substrate; c) at least partially impregnating the so-obtained product within an impregnation material to form a matrix incorporating the at least one electronic element and the first substrate; d) preparing or providing an impregnable second substrate, the second substrate being placed on top of the impregnated at least one electronic element so that the at least one electronic element is interposed between the first substrate and the second substrate; e) removing the first substrate from the impregnated product obtained; and f) recovering the composite material.