Composite-Bonded Electrostatic Chuck for Uniform Heat Transfer
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Solution Overview
Problem
Existing electrostatic chucks face issues with non-uniform heat transfer characteristics due to adhesive contraction during cooling, leading to thickness variations and deflection of the ceramic plate, which affects the uniformity of the adsorption face and temperature distribution.
Innovation Solution
A metal-based electrostatic chuck with a ceramic plate bonded using a 3D-printed composite material bonding layer, eliminating the need for thermal curing and ensuring a uniform thickness, thereby maintaining consistent heat transfer and reducing stress-induced cracking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If an adhesive agent is used to bond the ceramic plate to the base plate, then the ceramic plate can be bonded to the base plate, but the adhesive agent contracts during cooling causing non-uniform thickness and deflection of the ceramic plate
Solution Approach 1:
The invention changes the material parameters of the bonding layer by using a composite material with ceramic particles dispersed in a metal matrix. This material composition change allows the bonding layer to maintain uniform thickness during cooling while providing strong bonding between the ceramic plate and base plate, eliminating the contraction problem of organic adhesives.
Solution Approach 2:
The invention employs a composite material consisting of a metal matrix and ceramic particles for the bonding layer. This composite structure combines the advantages of both materials: the metal provides ductility and uniform thermal contraction, while the ceramic particles enhance bonding strength and thermal stability, thereby achieving both strong bonding and uniform thickness.
2Shape
If the adsorption face of the ceramic plate is polished to make it flat, then the flatness of the adsorption face is improved, but the thickness of the ceramic plate becomes non-uniform
Solution Approach 1:
The invention performs preliminary action by ensuring the bonding layer has uniform thickness before the ceramic plate is bonded to the base plate. By using a composite material bonding layer that does not contract during cooling, the ceramic plate maintains its original uniform thickness while achieving a flat adsorption face, eliminating the need for polishing that would reduce thickness.
3Ease of manufacture
If the ceramic plate is bonded in a deflected state, then the bonding process is simplified, but the heat transfer characteristic between the base plate and ceramic plate becomes non-uniform
Solution Approach 1:
The invention changes the thermal parameters by using a composite bonding layer with ceramic particles that has improved thermal conductivity and uniform thermal contraction characteristics. This allows the bonding layer to maintain uniform thickness during cooling, ensuring uniform heat transfer between the base plate and ceramic plate while keeping the bonding process simple.
4Temperature
If a metal-based bonding layer is used instead of an adhesive agent, then heat transfer uniformity is improved, but the bonding process becomes more complex
Solution Approach 1:
The invention uses a composite material bonding layer made of metal matrix with ceramic particles. This composite approach combines the excellent heat transfer uniformity of metal-based materials with the ease of application and bonding characteristics of adhesive-based processes, achieving both improved thermal performance and manufacturing simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a uniformly bonded electrostatic chuck with enhanced heat uniformity and reduced risk of ceramic plate cracking, ensuring efficient temperature adjustment and stable object adsorption.
Implementation Method 1
a first electrode configured to adsorb an object by electrostatic force according to a voltage applied to the first electrode
Implementation Method 2
a second electrode configured to generate heat according to a voltage applied to the second electrode
Implementation Method 3
when the adhesive agent in the uncured state is thermally cured, the ceramic plate is adhesively bonded to the base plate
Implementation Method 4
the adhesive agent adhesively bonding the base plate and the ceramic plate to each other contracts in a cooling process after the thermal curing
Data Source
AI summary
An electrostatic chuck includes a base plate that is made of a metal; a ceramic plate that is fixed to the base plate and configured to adsorb an object by electrostatic force; and a bonding layer that is provided between the base plate and the ceramic plate to bond the base plate and the ceramic plate to each other. The bonding layer is formed of a composite material including the metal forming the base plate and a ceramic forming the ceramic plate.