Thermally-Insulating Composite Elevation Panel
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Solution Overview
Problem
Current building elevation technologies face challenges with the durability and complexity of thermal insulation methods, particularly with thin ceramic boards that are prone to deformation and detachment due to thermal expansion differences, and the need for a single-step solution that combines thermal insulation, structural support, and aesthetic appeal.
Innovation Solution
A thermally-insulating composite elevation panel integrating a ceramic board with a metal framework and a layer of polyurethane polystyrene foam (PSUR) composite, which is produced using a low-pressure pouring process, providing a durable and aesthetically pleasing solution that eliminates the need for separate insulation and structural components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of moving object
If thin ceramic boards (2-3mm) are used for elevation, then weight and system complexity are reduced, but the boards become too fragile and susceptible to damage during mounting
Solution Approach 1:
The patent creates a composite structure by integrating the thin ceramic board with a foam core material and a support grid framework. This composite construction provides the necessary strength and rigidity to thin ceramic boards (2-3mm) that would otherwise be too fragile for handling and mounting, while maintaining the weight advantages of thin materials.
2Device complexity
If ceramic boards are bonded directly to thermally insulating material, then mounting is simplified, but thermal expansion differences cause deformation and detachment of the boards
Solution Approach 1:
The patent introduces a foam core material as an intermediary layer between the ceramic board and the support structure. This foam layer acts as a buffer that compensates for thermal expansion differences, preventing the deformation and detachment that would occur with direct bonding while still simplifying the mounting process.
Solution Approach 2:
The patent modifies the physical and chemical parameters of the bonding interface by using a foam material with specific adhesive properties and thermal characteristics. The foam's ability to change its mechanical properties (from rigid to flexible) in response to thermal conditions allows it to accommodate expansion differences while maintaining reliable adhesion.
3Manufacturing precision
If separate mounting of insulation and elevation boards is performed, then each component can be optimized, but the process becomes multi-step and technologically complex requiring trained personnel
Solution Approach 1:
The patent merges the insulation layer and elevation board mounting into a single integrated panel structure. The foam core serves both as thermal insulation and as the bonding medium for attaching the ceramic board to the support grid, eliminating the need for separate insulation installation and elevation mounting steps.
Solution Approach 2:
The foam core material performs multiple functions simultaneously: it provides thermal insulation, acts as an adhesive bonding layer, and serves as a cushioning element to accommodate thermal expansion. This multi-functionality reduces the number of components and steps required in the construction process.
4Device complexity
If traditional adhesive bonding is used for elevation boards, then mounting is simplified, but adhesives have limited lifetime and high price
Solution Approach 1:
The patent replaces traditional organic adhesives with a composite foam material that provides bonding functionality. The foam's cellular structure and chemical composition give it superior long-term durability and resistance to environmental degradation compared to conventional adhesives, while maintaining the simplicity of a bonding-based mounting system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution offers high thermal insulation, everlasting durability, reduced moisture absorption, and cost-effectiveness, allowing for the creation of energy-efficient, aesthetically appealing building elevations with reduced weight and simplified installation, suitable for high buildings and passive houses.
Implementation Method 1
A thermally-insulating composite elevation panel integrating a ceramic board with a metal framework and a layer of polyurethane polystyrene foam (PSUR) composite
Implementation Method 2
which is produced using a low-pressure pouring process
Data Source
Figure 1
Figure 2
AI summary
The present invention relates to a thermally-insulating composite elevation panel, characterised in that it comprises an elevation board (1) and a frame (3), preferably a metal one, which are permanently connected to each other through an insulating layer (2), the insulating layer being constituted by a plastic foam which, during its foaming process, permanently connects the elevation panel (1) with the frame (3). The invention relates also to a method for performing thereof and its use for simultaneous mounting of elevations and thermal insulation of buildings, especially high buildings.