Composite EM Shield Structure for RF Cross-Coupling Reduction
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Solution Overview
Problem
Microelectronic assemblies face performance limitations due to electromagnetic cross-coupling, particularly in compact high-power RF applications, where conventional electrical shields fail to effectively address both magnetic and electrical components of EM cross-coupling, leading to issues like impedance displacement and reduced RF performance.
Innovation Solution
The implementation of an enhanced electromagnetic shield structure comprising a combination of a magnetically-permeable material and an electrically-conductive material, with the magnetic shield layer having a higher permeability and lower conductivity than the electrical shield layer, positioned between signal paths to concentrate magnetic flux and reduce cross-coupling, while the electrical shield layer is grounded to minimize eddy currents and RF mismatch.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If conventional electrical shields are used to reduce EM cross-coupling, then electrical shielding is provided, but magnetic cross-coupling is not effectively addressed
Solution Approach 1:
The patent applies composite materials by combining electrically-conductive material (for electrical shielding) and magnetically-permeable material (for magnetic shielding) into a single integrated shield structure. This composite approach allows the shield to simultaneously address both electrical and magnetic components of EM cross-coupling, resolving the limitation of conventional single-material electrical shields that fail to effectively block magnetic fields.
Solution Approach 2:
The shield structure is segmented into distinct functional layers: an electrically-conductive layer for electrical shielding and a magnetically-permeable layer for magnetic shielding. This segmentation allows each layer to perform its specific function optimally, with the electrically-conductive layer addressing electrical cross-coupling and the magnetically-permeable layer addressing magnetic cross-coupling, thereby achieving comprehensive EM shielding effectiveness.
2Object-affected harmful factors
If shield structures are added to reduce cross-coupling, then EM shielding is improved, but device complexity increases
Solution Approach 1:
The patent merges the electrical shielding function and magnetic shielding function into a single integrated shield structure rather than using separate shields. By combining these functions in one structure with multiple layers performing different shielding roles, the overall device complexity is reduced compared to implementing separate electrical and magnetic shields, while still achieving comprehensive EM cross-coupling reduction.
3Volume of moving object
If compact form factor is used for high power RF applications, then space efficiency is improved, but EM cross-coupling increases
Solution Approach 1:
The integrated composite shield structure provides both electrical and magnetic shielding in a single compact component, enabling effective EM cross-coupling reduction without requiring additional space for separate shields. This allows the maintenance of compact form factors while addressing the increased cross-coupling that would otherwise result from close proximity of signal paths in compact high-power RF assemblies.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution significantly reduces magnetic cross-coupling and overall EM cross-coupling, improving isolation by up to 20 dB and maintaining RF performance, even at high frequencies and power levels, while being cost-effective and manufacturable.
Implementation Method 1
the magnetic shield layer having a higher permeability and lower conductivity than the electrical shield layer, positioned between signal paths to concentrate magnetic flux and reduce cross-coupling
Implementation Method 2
the electrical shield layer is grounded to minimize eddy currents and RF mismatch
Data Source
AI summary
Microelectronic packages, modules, systems, and other assemblies containing enhanced electromagnetic (EM) shield structures are provided, as are methods for fabricating electromagnetically-shielded microelectronic assemblies. In an embodiment, the electromagnetically-shielded microelectronic assembly includes first and second signal paths, which carry different electrical signals during operation of the microelectronic assembly. An EM shield structure is positioned between the first and second signal paths. The EM shield structure includes, in turn, a magnetic shield portion adjacent (e.g., in contact with and/or directly or indirectly bonded to) an electrical shield portion. The magnetic shield portion has a first magnetic permeability and a first electrical conductivity, while the electrical shield portion has a second magnetic permeability less than the first magnetic permeability and having a second electrical conductivity greater than the first electrical conductivity.