Composite EMI Shielding for Integrated Power Electronics
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Solution Overview
Problem
Current integrated power electronics packaging in electric and hybrid vehicles faces inefficiencies due to inadequate electromagnetic interference (EMI) shielding, particularly at high temperatures and vibrations, which degrades performance and requires improved polymer materials for effective EMI shielding.
Innovation Solution
A composite EMI shielding solution involving a polymer substrate with an EMI layer and a conductive coating, where the EMI layer is formed from materials like silicon, zinc, and ferrites, and the conductive coating is made from metals and ceramics, providing shielding efficiency across various frequencies and thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of moving object
If polymer materials are used for integrated power electronics packaging, then weight is reduced and integration is improved, but EMI shielding effectiveness deteriorates
Solution Approach 1:
The patent applies composite materials by combining polymer substrate with metal layers (aluminum, nickel, copper) and ceramic coatings to create a multi-layer structure that provides both the weight advantages of polymers and the EMI shielding effectiveness of metallic and ceramic materials. This composite approach resolves the contradiction by integrating materials with complementary properties.
Solution Approach 2:
The patent implements a nested multi-layer structure where metal EMI shielding layers and ceramic conductive coatings are embedded within or applied to the polymer substrate. This nesting arrangement allows the lightweight polymer to serve as the base structure while embedded metallic and ceramic layers provide the necessary EMI protection, thus resolving the shielding effectiveness issue without sacrificing weight advantages.
2Object-affected harmful factors
If metallic materials are used for packaging components, then EMI shielding effectiveness is improved, but weight increases
Solution Approach 1:
The patent uses composite materials by combining thin metal layers with polymer and ceramic materials to achieve effective EMI shielding at reduced weights. The multi-layer composite structure provides superior shielding performance compared to solid metal while maintaining significantly lower weight.
Solution Approach 2:
The patent employs thin metallic films and flexible polymer-ceramic composite shells to provide EMI shielding. These thin-layer structures achieve effective shielding performance while minimizing weight addition compared to traditional solid metallic packaging components.
3Temperature
If cooling materials are optimized for thermal management, then thermal conductivity is improved, but EMI shielding effectiveness deteriorates
Solution Approach 1:
The patent applies multi-functionality by designing the conductive coating and EMI shielding layers to simultaneously provide both thermal management and EMI protection. The same ceramic and metal layers that enhance thermal conductivity also maintain EMI shielding effectiveness, eliminating the need to compromise one function for the other.
Solution Approach 2:
The patent uses composite materials with both high thermal conductivity and EMI shielding properties, such as ceramic-metal composites and polymer-ceramic-metals multi-layer structures. These composites achieve dual functionality by combining materials that individually excel at different functions, allowing simultaneous optimization of thermal management and EMI protection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composite EMI shielding effectively reduces electromagnetic interference by 10-45 decibels across specific frequency ranges and enhances thermal conductivity, improving the performance and reliability of integrated power electronics by preventing demagnetization and vibration-induced degradation.
Implementation Method 1
electromagnetic interference (EMI) shielding is required over a broad range of frequencies
Implementation Method 2
the conductive coating exhibits at least one of a thermal conductivity in a range of 10 W/m-K to 200 W/m-K
Implementation Method 3
the conductive coating exhibits an electrical resistivity in the range of 1×10−5 Ohm-m to 1×10−8 Ohm-m
Data Source
AI summary
An electromagnetic interference shielding composite. The electromagnetic interference shielding composite includes a polymer substrate formed into a shape of a packaging component. The composite further includes an electromagnetic interference layer contacting the polymer substrate and a conductive coating contacting the electromagnetic interference layer. An integrated power electronic module includes packaging including the electromagnetic interference shielding composite. A method of forming the electromagnetic interference shielding composite for an integrated power electronic module includes molding a polymer substrate into a shape of a packaging component, forming an electromagnetic interference layer on the polymer substrate, and forming a conductive coating on the electromagnetic interference layer.