Composite Electronics Enclosure with Embedded Metallic Mesh

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Solution Overview

Problem

Aviation electronics, particularly large format batteries and high-power conversion electronics, require a chassis that reduces weight while maintaining or improving electromagnetic interference (EMI) suppression, structural integrity, and flammability performance, which current aluminum chassis fail to achieve effectively.

Innovation Solution

A lightweight electronics enclosure is created using a composite material with a metallic mesh, where the walls and lid are molded with a metallic mesh covered by multiple layers of carbon prepreg, cured to bond the mesh with the composite material, and secured with stainless-steel fasteners, offering a significant weight reduction and enhanced performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Weight of moving object

If aluminum chassis is used for housing aviation electronics, then structural integrity and EMI suppression are provided, but weight is excessive

Engineering Contradiction:
Improvechassis weightVSAvoidstructural integrity
Core Design Contradiction:
Weight of moving objectVSStrength

Solution Approach 1:

The patent applies composite materials by combining carbon fiber reinforced polymer (CFRP) with a conductive mesh layer embedded within the composite structure. This composite construction provides both the strength required for structural integrity and the electromagnetic shielding capabilities of metal, while achieving weight reduction of 50% or more compared to traditional aluminum chassis.

Inventive Principle:
Principle #40Composite materials

2Weight of moving object

If aluminum chassis is used for housing aviation electronics, then structural integrity is provided, but weight is excessive

Engineering Contradiction:
Improvechassis weightVSAvoidEMI suppression
Core Design Contradiction:
Weight of moving objectVSReliability

Solution Approach 1:

The conductive mesh embedded in the CFRP composite provides EMI suppression functionality while the composite structure itself contributes to overall reliability. The mesh acts as a Faraday cage, blocking electromagnetic interference, while the composite material provides structural support, achieving both EMI suppression and weight reduction simultaneously.

Inventive Principle:
Principle #40Composite materials

3Weight of moving object

If aluminum chassis is used for housing aviation electronics, then bonding and flammability protection are provided, but weight is excessive

Engineering Contradiction:
Improvechassis weightVSAvoidflammability
Core Design Contradiction:
Weight of moving objectVSObject-affected harmful factors

Solution Approach 1:

The CFRP composite material inherently provides flammability resistance as carbon fiber is non-combustible. The embedded conductive mesh further enhances safety by providing thermal management capabilities and additional fire protection. This composite construction eliminates the need for heavy aluminum while maintaining or improving flammability performance.

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The composite chassis achieves a 50% or more weight reduction compared to aluminum enclosures while maintaining equal or improved EMI suppression, structural integrity, and flammability performance, making it suitable for weight-conscious applications like avionics and power equipment.

Implementation Method 1

the epoxy from the carbon prepreg bonds the metallic mesh to the carbon fabric in the carbon prepreg

Methodology Applied
Scientific EffectChemical Bonding: Chemical Bonding

Implementation Method 2

the metallic mesh is permanently bonded to the composite material via a cured resin epoxy

Methodology Applied
Scientific EffectChemical Bonding: Chemical Bonding

Data Source

PatentUS10921859B2Composite electronics cases and methods of making and using the same
Publication Date: 2021.02.16 SECURAPLANE TECHNOLOGIES INC
  • US10921859B2 patent drawing
  • US10921859B2 patent drawing
  • US10921859B2 patent drawing

AI summary

A method of making an electronics enclosure that is light-weight, structurally sound and EMI resistant is provided. Preferably the electronics enclosure is made by covering the walls of a mold for the chassis and the lid with a metallic mesh. At least two plies of carbon prepreg are applied over the metallic mesh. The carbon prepreg and metallic mesh are then cured together at high temperature, typically in an autoclave. The wire mesh becomes integrated into the composite material during the curing process when the carbon material shrinks to the mold and the epoxy bonds with the wire mesh. The molds may then be removed leaving an electronics enclosure with superior properties.