Composite Functional Film Edge Support for OLED Die-Cutting Curling

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Solution Overview

Problem

The existing composite functional films used in OLED screens face issues with curling during the die-cutting process, leading to increased bonding tolerance and decreased yield, which affects the display quality.

Innovation Solution

A composite functional film is designed with a heat dissipation layer comprising a first and second part, a buffer layer corresponding to the first part, and a supporting layer with a greater elastic modulus corresponding to the second part, reducing the probability of curling during die-cutting.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If a buffer layer with soft material is used to provide buffering function, then the buffer function is improved, but the support strength is insufficient causing copper foil to curl during die-cutting

Engineering Contradiction:
Improvebuffering functionVSAvoidsupport strength
Core Design Contradiction:
Object-affected harmful factorsVSStrength

Solution Approach 1:

The heat dissipation layer is divided into a first part (central region) and a second part (edge region), with the buffer layer and supporting layer selectively disposed under different parts to provide differentiated support and buffering functions

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The supporting layer with higher elastic modulus is specifically disposed under the second part (edge region) of the heat dissipation layer where curling occurs during die-cutting, providing localized support strength where needed while maintaining buffering function under the first part

Inventive Principle:
Principle #3Local quality

2Productivity

If die-cutting process is used to manufacture composite functional film, then manufacturing efficiency is improved, but curling occurs during cutting process leading to identification errors and bonding failures

Engineering Contradiction:
Improvemanufacturing efficiencyVSAvoidcutting precision
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The supporting layer is pre-disposed under the heat dissipation layer before die-cutting, providing support in advance to prevent curling during the cutting process, thereby maintaining both manufacturing efficiency and cutting precision

Inventive Principle:
Principle #10Preliminary action

3Temperature

If copper foil is used for heat dissipation, then heat dissipation function is improved, but the copper foil curls during die-cutting process affecting AOI identification and bonding quality

Engineering Contradiction:
Improveheat dissipation functionVSAvoidflatness stability
Core Design Contradiction:
TemperatureVSStability of the object's composition

Solution Approach 1:

The patent creates a composite structure combining copper foil (heat dissipation layer) with buffer layer and supporting layer (differentiated support structure), where the supporting layer with higher elastic modulus prevents curling and maintains flatness stability while preserving heat dissipation function

Inventive Principle:
Principle #40Composite materials

Data Source

PatentUS12310173B2Composite functional film, manufacturing method for same, and display device
Publication Date: 2025.05.20 WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO LTD
  • US12310173B2 patent drawing
  • US12310173B2 patent drawing
  • US12310173B2 patent drawing

AI summary

A composite functional film, a manufacturing method for same, and a display device are provided by the present application. The composite functional film includes a heat dissipation layer including a first part and a second part arranged around an outside of the first part; a buffer layer disposed on a side of the heat dissipation layer and disposed corresponding to the first part; a supporting layer disposed on the side of the heat dissipation layer and disposed corresponding to the second part; and the buffer layer and the supporting layer are disposed on a same side of the heat dissipation layer, and an elastic modulus of the supporting layer is greater than an elastic modulus of the buffer layer.