Composite Filter Bump Layout for Low-Parasitic RF Modules

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Solution Overview

Problem

The existing radio frequency front end circuits suffer from increased parasitic capacitance due to intersecting wires between filters and low noise amplifiers, leading to deteriorated amplification characteristics in both transmission and reception paths.

Innovation Solution

A composite filter component design where filters with overlapping pass bands are connected through input and output bumps to minimize wire intersections, reducing parasitic capacitance and maintaining amplification characteristics.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If multiple filters and low noise amplifiers are connected by wires in a conventional layout, then the circuit can support multiple frequency bands, but parasitic capacitance increases due to wire intersections, causing noise figure deterioration and amplification characteristic degradation

Engineering Contradiction:

Improvemulti-band compatibilityVSAvoidparasitic capacitance

Core Design Contradiction:

Adaptability or versatilityVSObject-affected harmful factors

Solution Approach 1:

The patent transitions from a planar wire-based connection to a three-dimensional bump connection structure. By using bumps that extend vertically from the substrate surface, the connection moves from a two-dimensional plane to a three-dimensional space, allowing filters to be arranged in a grid pattern without wire intersections, thus eliminating parasitic capacitance while maintaining multi-band compatibility

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent combines multiple filters (first, second, third, and fourth filters for different frequency bands) into a single integrated filter component with a grid arrangement. This merging of multiple filters into one component, connected via bumps to amplifiers, reduces the number of separate components and connections, thereby reducing overall parasitic capacitance while supporting multiple frequency bands

Inventive Principle:

Principle #5Merging (Combining)

2Ease of manufacture

If wires are used to connect filters and amplifiers, then the module can be assembled, but the module size increases and amplification characteristics deteriorate due to parasitic capacitance

Engineering Contradiction:

Improvemodule assemblyVSAvoidamplification loss

Core Design Contradiction:

Ease of manufactureVSLoss of energy

Solution Approach 1:

The patent replaces the mechanical wire-based connection system with an electrical bump connection system. The bumps serve as both mechanical connectors and electrical conductors, integrating the connection function into a single structure that is easier to manufacture through standard semiconductor bump bonding processes while minimizing parasitic capacitance and amplification loss

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Data Source

PatentUS20250233603A1Composite filter component and radio frequency module

Publication Date: 2025.07.17 MURATA MFG CO LTD

AI summary

A composite filter component includes a filter causing a signal of a band AL reception band to pass through, a filter causing a signal of a band BL reception band to pass through, a filter causing a signal of a band AM reception band configured to be simultaneously received with a signal of the band AL to pass through, a filter causing a signal of a band BM reception band configured to be simultaneously received with a signal of the band BL to pass through.