Composite Grid-Stiffened Panel with Integrated Fluid Channels
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Solution Overview
Problem
Traditional spacecraft thermal management systems face limitations in efficiently dissipating high heat flux densities due to their weight, complexity, and inflexibility, which are exacerbated by the need for custom designs and inadequate heat rejection capabilities, especially in compact, modular, and rapidly deployable spacecraft.
Innovation Solution
A method of fabricating a structural panel with integrated pumped-fluid loop thermal management systems that maintains the panel's stiffness-to-mass ratio by incorporating supply and distribution channels within the ribs and face sheet, utilizing a network of pumps and valves to control fluid flow, inspired by biological circulatory systems, allowing for variable heat transfer rates and improved thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of moving object
If traditional conduction-based thermal management is used, then the thermal control system is simple and lightweight, but the heat dissipation capacity is severely limited and electronic component placement is restricted
Solution Approach 1:
The patent merges the structural panel with the thermal management system by integrating fluid channels directly into the panel ribs and face sheets. This combination allows the panel to serve dual functions: providing structural support and enabling active heat transport, thereby increasing heat dissipation capacity without adding separate thermal control components and their associated mass.
Solution Approach 2:
The panel is designed to perform multiple functions simultaneously: structural support, fluid transport for thermal management, and potential electronic component mounting. The integrated channels within the ribs and face sheets allow the same structural element to serve as both load-bearing component and thermal management conduit, enhancing heat dissipation without increasing system mass.
2Reliability
If heat pipes or loop heat pipes are used to transport heat farther distances, then heat transport capacity increases, but the system adds significant weight, volume, and complexity
Solution Approach 1:
The patent combines the fluid transport channels with the structural panel ribs, eliminating the need for separate heat pipe assemblies. The channels are integrated directly into the panel structure during manufacturing, reducing system complexity and removing the need for custom-designed heat pipe components while maintaining effective heat transport capacity.
Solution Approach 2:
The structural ribs serve dual purposes: providing mechanical support and housing fluid channels for heat transport. This multi-functionality eliminates the need for dedicated heat pipe components, reducing system complexity and volume while maintaining the ability to transport heat over required distances.
3Reliability
If pumped fluid loops are used to achieve higher heat flux capacities, then heat dissipation capacity increases, but the system adds significant mass and suffers from reliability issues
Solution Approach 1:
The patent merges the pumped fluid loop system with the structural panel by integrating channels directly into the ribs and face sheets. This integration eliminates the need for separate piping, reduces the mass of thermal control components, and improves reliability by creating a more compact system with fewer connection points and potential failure modes.
Solution Approach 2:
The patent changes the physical parameters of the thermal management system by transitioning from conventional separate-component designs to an integrated panel structure. The channel geometry, fluid flow paths, and heat exchange surfaces are optimized within the panel structure itself, achieving higher heat flux capacities with reduced mass compared to traditional pumped fluid loop systems.
4Reliability
If electronic components are mounted on the inside of the structural panel to maximize conduction effectiveness, then heat transport distance is minimized, but the placement of electronic components is severely restricted
Solution Approach 1:
The integrated panel with embedded channels provides multiple functional zones: structural ribs for support, internal channels for fluid flow, and accessible surfaces for electronic component mounting. This multi-functionality allows electronic components to be placed in various locations on the panel exterior while maintaining effective thermal connection through the panel structure, significantly increasing placement flexibility.
Solution Approach 2:
The patent transitions from one-dimensional conduction through the panel thickness to a three-dimensional thermal management system with fluid channels distributed throughout the panel structure. This allows heat to be transported actively through the fluid loops while maintaining component placement flexibility across the panel surface, rather than being constrained to specific locations for passive conduction.
5Ease of manufacture
If traditional thermal management techniques are used, then the system is simple to design, but they cannot meet the thermal requirements of next-generation high-power spacecraft
Solution Approach 1:
The patent combines structural panel fabrication with thermal channel integration in a single manufacturing process. The channels are formed within the ribs and face sheets during composite layup and curing, eliminating the need for separate thermal system installation and simplifying the overall design process while achieving the heat flux capacities required for next-generation spacecraft.
Solution Approach 2:
The patent optimizes the physical parameters of the panel structure to achieve both structural and thermal performance. By adjusting channel geometry, rib spacing, and composite material properties during the design and manufacturing process, the system meets high heat flux requirements while maintaining ease of manufacture through standardized composite fabrication techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables a lightweight, high-stiffness panel that can efficiently manage high heat flux densities with variable thermal performance, supporting modular and reconfigurable spacecraft thermal management without significant mass or volume addition, and can be rapidly integrated into satellite buses.
Implementation Method 1
A method of fabrication is disclosed herein by which a pumped-fluid loop thermal management system with variable flow properties is integrated into the ribs and face sheet of a low-mass structural panel
Implementation Method 2
Heat is conducted from the electronic components, through the panel, and to the radiator where it is rejected to space
Implementation Method 3
The outside of the panel serves as a radiator to space. Heat is conducted from the electronic components, through the panel, and to the radiator where it is rejected to space
Data Source
AI summary
A method for fabricating a grid-stiffened panel which incorporates a network of fluid channels and passageways into the ribs and face sheet is described. The method is comprised of a base tooling assembly, an expansion tooling assembly, a composite prepreg, plugs, a face sheet and a network of valves and pumps, wherein the prepreg is draped over said expansion tooling and assembled with the base tooling assembly to form a rib structure. Channel plugs are placed therein such that gaps between adjacent expansion tooling blocks are filled, and the entire rib structure assembly is autoclaved. The face sheet may be comprised of a plurality of layers, whereby channels are machined into the lower layer(s). The upper layer(s) are bonded to the lower layer(s) to seal the channels, and said face sheet is bonded to the rib structure.