Composite Heat Conducting Part Reducing Weight

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Conventional heat conducting components like vapor chambers and heat pipes, made of copper, are heavy, which hinders lightweight design and portability in electronic devices, particularly in portable electronics where heat dissipation is crucial.

Innovation Solution

A heat conducting part with a shell structure comprising an inner copper or copper alloy layer for durability and a lighter outer layer made of aluminum or titanium alloys, combined with a capillary structure for efficient heat transfer, reducing overall weight while maintaining structural strength and heat dissipation efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a conventional vapor chamber or heat pipe made of copper is used, then heat dissipation performance is ensured, but the weight increases significantly

Engineering Contradiction:
Improveheat dissipation performanceVSAvoidweight of heat conducting part
Core Design Contradiction:
TemperatureVSWeight of moving object

Solution Approach 1:

The patent applies composite materials by combining copper (for heat conduction) with aluminum alloy or titanium alloy (for lightweight structure). The copper layer provides excellent thermal conductivity while the aluminum or titanium alloy layer reduces overall weight and provides structural strength, resolving the contradiction between heat dissipation performance and weight.

Inventive Principle:
Principle #40Composite materials

2Reliability

If copper material is used for the heat conducting part, then durability and corrosion resistance are improved, but weight increases

Engineering Contradiction:
Improveservice lifeVSAvoidweight of heat conducting part
Core Design Contradiction:
ReliabilityVSWeight of moving object

Solution Approach 1:

The composite structure maintains durability through the copper layer which provides corrosion resistance and longevity, while the aluminum or titanium alloy layer contributes to weight reduction. This composite approach preserves reliability while addressing the weight issue.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent applies local quality by having different material layers serve different functions: the copper layer specifically provides corrosion resistance and durability where needed, while the aluminum or titanium alloy layer provides lightweight structural support, allowing each material to optimize its local contribution to the overall performance.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides a lightweight, high-strength heat conducting part with a long service life, enhancing the portability and user experience of electronic devices by effectively dissipating heat without compromising structural integrity or manufacturing complexity.

Implementation Method 1

the cooling liquid in the cavity starts to be gasified after being heated in a low-vacuum-degree environment. At this moment, heat energy is absorbed, the volume is rapidly expanded

Methodology Applied
Scientific EffectEvaporation: Evaporation

Implementation Method 2

When heat is conducted to an evaporation area from a heat source, the cooling liquid in the cavity starts to be gasified

Methodology Applied
Scientific EffectPhase change: Phase Change

Implementation Method 3

When the gas-phase working medium comes into contact with a cold area, a condensation phenomenon is resulted, heat accumulated during evaporation is released

Methodology Applied
Scientific EffectCondensation: Condensation

Implementation Method 4

the condensed cooling liquid returns to the heat source through the fine structure

Methodology Applied
Scientific EffectCapillary action: Capillary Action

Implementation Method 5

When heat is conducted to an evaporation area from a heat source

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentEP3971681B1Heat-conducting member and electronic device
Publication Date: 2024.06.19 HUAWEI TECH CO LTD
  • EP3971681B1 patent drawingFigure 1~2
  • EP3971681B1 patent drawingFigure 3~4
  • EP3971681B1 patent drawingFigure 5~6

AI summary

This application provides a heat conducting part and an electronic device. The heat conducting part includes a shell, including an inner layer and an outer layer, where a cavity is enclosed by the inner layer, and the outer layer wraps a periphery of the inner layer; a capillary structure, disposed in the cavity and abutting against the shell; and cooling liquid, located in the cavity, where the inner layer and the outer layer are made of different materials, and a material density of the outer layer is lower than a material density of the inner layer. In the heat conducting part provided in this application, a material with a relatively large density and a stable chemical property may be selected for the inner layer to ensure durability of the heat conducting part. A material with a relatively small density may be selected for the outer layer to ensure a structural strength of the shell and reduce an overall weight of the shell. Combining the inner layer and the outer layer can not only ensure working stability of the heat conducting part, but also ensure the structural strength of the heat conducting part, to avoid damages caused by external force. In addition, the weight of the shell is effectively reduced, which is conducive to a lightweight design.