Composite Heat Dissipation Material for Miniaturized Electronics
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional heat dissipation materials, particularly metal materials, struggle to efficiently dissipate heat in miniaturized electronic devices while maintaining a lightweight design, leading to potential damage from high temperatures.
Innovation Solution
A composite heat dissipation material is developed, comprising multiple layers of graphite materials and a graphitic heat dissipation layer with a metal layer, which provides a three-dimensional heat dissipation path to efficiently cool heat sources.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If metal materials are used for heat dissipation, then heat dissipation efficiency is improved, but device weight increases
Solution Approach 1:
The patent employs a composite structure consisting of a metal layer and a graphite layer stacked together. The metal layer provides high thermal conductivity for efficient heat dissipation, while the graphite layer adds dimensional stability and structural support. This composite approach allows the device to achieve effective heat dissipation without relying solely on heavy metal materials throughout the entire structure.
Solution Approach 2:
The invention applies different materials to different regions of the heat dissipation component. The metal layer is positioned to directly contact the heat source for maximum thermal conductivity, while the graphite layer is arranged in specific patterns (such as mesh or grid structures) to provide structural support and additional heat dissipation pathways. This localized material distribution optimizes both weight and heat dissipation efficiency.
2Volume of moving object
If device size is reduced for miniaturization, then device portability is improved, but heat dissipation capability deteriorates
Solution Approach 1:
The patent utilizes a layered two-dimensional structure where the metal layer and graphite layer are stacked in the thickness direction. This dimensional arrangement allows the heat dissipation component to maintain effective thermal conduction pathways even when the planar dimensions are reduced for miniaturization. The layered structure provides multiple heat dissipation routes that are not constrained by the reduced device footprint.
Solution Approach 2:
The heat dissipation component is segmented into distinct functional layers: a metal layer for direct heat conduction from the heat source and a graphite layer for structural support and additional heat dissipation. This segmentation allows each layer to be optimized independently for its specific function, enabling effective heat dissipation in miniaturized devices where space is limited.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composite heat dissipation material effectively dissipates heat energy generated from heat sources, preventing damage due to high temperatures and improving heat dissipation efficiency in miniaturized devices.
Implementation Method 1
a graphitic heat dissipation layer which provides a three-dimensional heat dissipation path to efficiently cool heat sources
Implementation Method 2
The composite heat dissipation material effectively dissipates heat energy generated from heat sources
Data Source
AI summary
The present disclosure provides a composite heat dissipation material. The composite heat dissipation material includes at least one graphite layer and a graphitic heat dissipation layer. The graphitic heat dissipation layer includes a graphite material layer. Further, the graphitic heat dissipation layer is disposed on one side of the at least one first graphite layer, and the graphitic heat dissipation layer is bonded to the graphite layer. The graphitic heat dissipation layer is scarfed with one of the at least one graphite layer by interspersing graphite. The composite heat dissipation material of the present disclosure can efficiently and rapidly dissipate heat energy produced from a heating source, thereby lowering temperature thereof.