Composite Heat Dissipation Member for Electronic Device Thermal Management
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Solution Overview
Problem
There is a need for improved heat dissipation in electronic devices to enable high-speed and high-capacity information processing while maintaining a lightweight and thin design, as existing solutions are inadequate in efficiently managing heat generated by components like processors and batteries.
Innovation Solution
The electronic device incorporates a heat generating body unit with a first heat dissipation member composed of an electromagnetic sheet and a graphite sheet, which are laminated and adhered to each other, and a fourth heat dissipation member that extends along the longitudinal direction of the device, sandwiched between the battery and the external case, to effectively dissipate heat generated by the processor and transfer it to the battery, enhancing heat diffusibility and structural strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat dissipation structures are added to improve heat management, then heat dissipation efficiency is improved, but device thickness and weight increase
Solution Approach 1:
The patent employs a composite heat dissipation structure combining aluminum alloy (high thermal conductivity) and graphite (high heat diffusion capability). The aluminum alloy heat dissipation member is coupled with a graphite sheet, creating a composite structure that achieves superior heat management performance while controlling weight. The graphite layer provides high heat diffusion in the in-plane direction, complementing the aluminum alloy's thermal conductivity.
Solution Approach 2:
The heat dissipation structure is integrated within the existing device architecture. The aluminum alloy heat dissipation member is positioned between the processor and other components, with the graphite sheet coupled to its surface. This nested arrangement allows the heat dissipation function to be embedded within the device's longitudinal structure without adding significant thickness.
2Temperature
If heat dissipation structures are added to improve heat management, then heat dissipation efficiency is improved, but device thickness increases
Solution Approach 1:
The patent uses a thin graphite sheet as part of the heat dissipation structure. The graphite sheet is coupled to the aluminum alloy heat dissipation member, providing high heat diffusion capability in a thin-film form factor. This allows effective heat management without significantly increasing device thickness.
Solution Approach 2:
The heat dissipation approach utilizes multiple dimensions: the aluminum alloy heat dissipation member conducts heat in the vertical direction (from processor), while the coupled graphite sheet diffuses heat in the in-plane horizontal direction. This multi-dimensional heat transfer strategy improves heat management efficiency without requiring increased thickness in any single dimension.
3Productivity
If high-speed and large-capacity information processing is implemented, then processing performance is improved, but heat generation increases
Solution Approach 1:
The patent converts the harmful heat generated by high-performance processing into a manageable thermal flow. The aluminum alloy heat dissipation member is positioned to receive heat from the processor, and the coupled graphite sheet diffuses this heat laterally. The battery is strategically positioned to act as a heat sink, absorbing some of the generated heat. Thus, the harmful heat generation from high-performance processing is converted into a controlled thermal management scenario.
4Temperature
If the battery is positioned to optimize heat dissipation, then heat transfer efficiency is improved, but structural arrangement becomes more complex
Solution Approach 1:
The battery serves multiple functions: it provides power storage and simultaneously acts as a heat sink for thermal management. By positioning the battery adjacent to the aluminum alloy heat dissipation member, the structure utilizes the battery's mass and thermal properties to absorb and dissipate heat. This multi-functional approach improves heat transfer efficiency without requiring separate heat sink components, thereby simplifying the overall structural arrangement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves heat dissipation efficiency, maintains structural integrity, and prevents an increase in device thickness and weight, allowing for efficient heat transfer from the processor to the battery, thereby addressing the challenge of managing heat in compact electronic devices.
Implementation Method 1
a graphite sheet 332 having a higher thermal conductivity in the thickness direction than in the in-plane direction
Implementation Method 2
an aluminum alloy heat dissipation member having a higher thermal conductivity in the in-plane direction than in the thickness direction
Data Source
AI summary
An electronic device includes a heat generating body including a first heat dissipation member on a first surface, a battery including a second heat dissipation member on a second surface, a third heat dissipation member in contact with a support body, and a fourth heat dissipation member. The fourth heat dissipation member is sandwiched between the first heat dissipation member and the third heat dissipation member in a state in which at least a portion of the fourth heat dissipation member is in contact with the first surface via the first heat dissipation member, and an other portion of the fourth heat dissipation member is in contact with the second surface of the battery via the second heat dissipation member.