Composite Heat Dissipation Assembly for Multiple Heat Sources
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Solution Overview
Problem
Conventional heat dissipation mechanisms are ineffective for multiple heat sources in electronic devices, as air cooling and liquid cooling systems are limited to single heat sources, necessitating improved cooling solutions.
Innovation Solution
A composite heat dissipation assembly combining air-cooling and liquid-cooling systems, utilizing a thermal conductive base, heat pipes, and a position limiter to secure the liquid-cooling device, preventing deformation of heat sinks and enhancing heat exchange efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional air cooling or liquid cooling is used, then heat dissipation from a single heat source is effective, but heat dissipation from multiple heat sources is insufficient
Solution Approach 1:
The patent combines air cooling and liquid cooling systems into a single composite heat dissipation assembly. The air cooling device includes a thermal conductive base with heat pipes, while the liquid cooling device includes a liquid block with coolant channels. Both systems are integrated to work simultaneously on different heat sources, allowing the device to handle multiple heat generation points effectively.
Solution Approach 2:
The composite heat dissipation assembly is designed to serve multiple heat sources with different cooling requirements. The air cooling portion handles heat sources suitable for air convection, while the liquid cooling portion handles heat sources requiring higher cooling efficiency. This multi-functional design allows a single assembly to adapt to various thermal management needs.
2Ease of manufacture
If air cooling and liquid cooling devices are connected without a position limiter, then assembly is simple, but relative movement causes deformation of heat sinks and reduced heat exchange efficiency
Solution Approach 1:
The position limiter acts as an intermediary component between the air cooling device and liquid cooling device. It includes limiting portions that extend from both devices to meet and engage with each other, preventing excessive relative movement while maintaining proper thermal contact. This intermediary structure ensures stable connection without compromising the simplicity of assembly.
Solution Approach 2:
The position limiter is designed with specific geometric parameters - the limiting portions have predetermined lengths and engagement forces that allow sufficient movement for assembly but prevent excessive movement during operation. By carefully controlling these dimensional parameters, the system achieves both ease of assembly and operational stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composite assembly maintains energy efficiency and high heat dissipation performance by stabilizing the connection between air-cooling and liquid-cooling components, effectively managing multiple heat sources.
Implementation Method 1
a thermal conductive base (111)... configured to be thermally coupled to a heat source
Implementation Method 2
a plurality of heat pipes (112)... disposed on the thermal conductive base
Implementation Method 3
a circulating liquid cooling system comprised of a liquid block (121)... a cooling fluid absorbs heat from the heat source
Data Source
AI summary
A composite heat dissipation assembly includes an air-cooling heat dissipation device having a thermal conductive base and a plurality of heat pipes, the plurality of heat pipes are disposed on the thermal conductive base, the thermal conductive base includes a first joint on a top side and is configured to be thermally coupled to a heat source on a bottom side opposite to the top side, a liquid-cooling heat dissipation device having a liquid block, the liquid block includes a second joint on a bottom side and is configured to be attached to the first joint so that the liquid block is thermally coupled to the thermal conductive base and a position limiter disposed at a position where the first joint is coupled to the second joint so that relative movement between the air-cooling heat dissipation device and the liquid-cooling heat dissipation device.