Composite Capillary Heat Pipe for Low-Resistance Liquid Backflow
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Solution Overview
Problem
Existing heat pipes face challenges in balancing capillary pressure and permeability, leading to high liquid backflow resistance and inefficient heat transfer performance, especially in miniaturized, lightweight, and high-performance electronic devices.
Innovation Solution
A heat pipe design featuring a first capillary structure with high capillary pressure wrapping a second capillary structure with high permeability, creating a composite structure that facilitates rapid liquid-vapor phase change and reduces backflow resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single capillary structure is used in the heat pipe, then the structure is simple, but the liquid backflow resistance is high and heat transfer performance is insufficient
Solution Approach 1:
The heat pipe is divided into an evaporation section and a condensation section, with different capillary structures in each section. The evaporation section has a first capillary structure with larger pore size for efficient liquid supply, while the condensation section has a second capillary structure with smaller pore size for effective liquid backflow, resolving the contradiction between structural simplicity and heat transfer performance
Solution Approach 2:
Different capillary structures are applied to different sections of the heat pipe based on local requirements. The evaporation section uses a capillary structure optimized for liquid absorption and transport, while the condensation section uses a capillary structure optimized for liquid backflow, allowing each section to have optimal performance for its specific function
2Quantity of substance
If the capillary structure has large permeability, then liquid backflow resistance is reduced, but capillary pressure decreases
Solution Approach 1:
The capillary structure is segmented into two sections with different permeability characteristics. The evaporation section has larger permeability to facilitate liquid supply from the reservoir, while the condensation section has smaller permeability to generate sufficient capillary pressure for liquid backflow, thus resolving the contradiction between permeability and capillary pressure
Solution Approach 2:
The pore size parameter of the capillary structure is changed along the length of the heat pipe. The pore size is larger in the evaporation section to provide high permeability for liquid supply, and smaller in the condensation section to provide high capillary pressure for backflow, allowing the system to achieve both high permeability and high capillary pressure through parameter variation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances heat transfer performance by accelerating liquid-vapor phase circulation, preventing dry-out and liquid aggregation, and improving user experience by reducing noise and structural stability.
Implementation Method 1
The capillary pressure of the first capillary structure is greater than the capillary pressure of the second capillary structure
Implementation Method 2
The first capillary structure is attached to an inner pipe surface of the pipe body. The second capillary structure is wrapped inside the first capillary structure
Implementation Method 3
a working fluid in the heat pipe can rapidly and fully participate in cyclic heat transfer working in a liquid-vapor phase change
Implementation Method 4
rapidly transports to an evaporation part
Implementation Method 5
heat transfer performance of the heat pipe, to effectively avoid dry-out at the evaporation part and liquid aggregation at the condensation part
Implementation Method 6
A heat pipe (Heat Pipe) is a heat transfer element that rapidly transfers heat by using a liquid-vapor phase change
Data Source
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AI summary
This application discloses a heat pipe, a heat sink, and an electronic device, where the heat pipe includes a pipe body, a first capillary structure, and a second capillary structure. The pipe body has an accommodation cavity therein, and the accommodation cavity is configured to seal a working fluid. The first capillary structure is attached to an inner pipe surface of the pipe body. The second capillary structure is wrapped inside the first capillary structure. According to the heat pipe in this application, the first capillary structure having a relatively large capillary pressure wraps the second capillary structure having a relatively large permeability, so that a composite capillary structure having a high-speed backflow channel is formed in the heat pipe. Therefore, advantages of different capillary structures are fully utilized, so that the working fluid in the heat pipe rapidly and fully participates in cyclic heat transfer in a liquid-vapor phase change, thereby improving heat transfer performance of the heat pipe.