Composite Heat Sink with Thermal Coating for LED Thermal Management
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Solution Overview
Problem
Current heat radiation devices for LED retrofit lamps face challenges with high weight, limited design freedom, and high manufacturing costs, particularly when using aluminum, and thermal conductivity issues with thermally conductive plastics and ceramics.
Innovation Solution
A composite heat radiation device with a low-cost, low-thermal-conductivity body made of materials like PBT, PET, or ABS, combined with a high-thermal-conductivity coating layer, such as nickel or graphite, and featuring thermal vias for enhanced heat dissipation, allowing for efficient thermal management and complex configurations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If aluminum is used as heat radiation device material, then thermal conductivity is improved, but weight and manufacturing cost increase
Solution Approach 1:
The patent uses a composite structure combining aluminum alloy (high thermal conductivity) and zinc alloy (lower density) in different sections of the heat radiation device. The aluminum alloy is used where high heat conduction is critical, while the zinc alloy reduces overall weight and manufacturing cost, achieving a balance between thermal performance and weight reduction.
2Weight of stationary object
If thermally conductive plastic is used, then weight and cost are reduced, but thermal conductivity deteriorates
Solution Approach 1:
The patent applies different materials to different sections of the heat radiation device based on local thermal requirements. High-thermal-conductivity aluminum alloy is used in the base section for efficient heat conduction, while lighter zinc alloy is used in the fin sections where weight reduction is prioritized, creating local optimization of material properties.
3Reliability
If complex shape design is implemented, then heat dissipation efficiency is improved, but manufacturing complexity increases
Solution Approach 1:
The heat radiation device is segmented into multiple sections (base section and fin sections) that can be manufactured separately and then assembled. This segmentation allows each part to be optimized for its specific function while simplifying the manufacturing process, as complex fin structures can be produced as separate components rather than requiring complex monolithic manufacturing.
4Reliability
If heat radiation device size is increased, then heat dissipation capability is improved, but device volume increases
Solution Approach 1:
The patent extends the heat dissipation structure in the vertical dimension by creating fin sections that project upward from the base. This vertical extension increases the effective heat dissipation surface area without significantly increasing the horizontal footprint, allowing improved heat dissipation capability while maintaining compact overall device volume.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides effective thermal dissipation performance at a lower cost and weight, improving the efficiency and longevity of LED lamps by efficiently transferring heat from the LED chip to ambient surroundings.
Implementation Method 1
The heat conduction through the heat radiation device itself is associated with the following factors: thermal conductivity of heat radiation device materials (k), conduction area (A) and length (L) (Fourier law: Q=k×A×ΔT/L)
Implementation Method 2
The heat convection from the heat radiation device to the ambient surroundings is associated with the following factors: surface area (A) and local convection heat transfer coefficient (h) (Newton law: Q=h×A×ΔT), which depends on the size and geometry shape of the heat radiation device
Implementation Method 3
The heat radiation from the heat radiation device surface to the ambient surroundings is associated with the following factors: surface area (A) and surface emissivity (ε) (Stefan-Boltzmann law: Q=ε×A×σ×ΔT4, where σ is the Stefan-Boltzmann constant)
Data Source
AI summary
Various embodiments relate to a heat radiation device for a heat source. The heat radiation device includes a body and a coating layer, wherein the body has a first section and at least one second section projecting from the first section, the first section has a mounting surface for mounting and thermally contacting with the heat source and the coating layer is applied on the surface other than the mounting surface of the first section and a surface of the at least one second section, wherein the coating layer has higher thermal dissipation performance than the body. In addition, various embodiments further relate to an illuminating device having the above type of heat radiation device.