Composite Heat Sink Fins and Side Wall for Lower-Cost Cooling

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing methods for producing heat sinks are costly and inefficient, particularly in the production of heat sinks for semiconductor arrangements in power converters, where high insulation and thermal conductivity requirements are not adequately met.

Innovation Solution

A method involving extrusion using a die and punch to form fins and a peripheral side wall on a heat sink, utilizing a first metal material for the semifinished product and a second metal material with higher thermal conductivity, connected via a releasable adhesive or pressure welding, to create a heat-spreading surface without additional joining steps.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If existing methods for producing heat sinks are used, then production costs are high, but manufacturing precision and thermal conductivity requirements are not adequately met

Engineering Contradiction:
Improvethermal conductivityVSAvoidproduction cost
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The heat sink is divided into two distinct material zones: a first metal material (e.g., aluminum alloy) forming the main body and fins, and a second metal material (e.g., copper or copper alloy) forming a heat-spreading surface layer. This segmentation allows each material to be optimized for its specific function while being produced in a single extrusion process, thereby improving thermal conductivity without significantly increasing production cost.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent employs composite materials by combining two different metal materials with distinct thermal properties within a single heat sink structure. The first metal material provides cost-effectiveness and adequate structural properties, while the second metal material with higher thermal conductivity is strategically placed at the heat-spreading surface to meet thermal performance requirements. This composite approach resolves the contradiction between manufacturing precision (thermal conductivity) and ease of manufacture (production cost).

Inventive Principle:
Principle #40Composite materials

2Manufacturing precision

If a heat sink with peripheral side wall is produced by existing extrusion methods, then production is simplified, but manufacturing precision and structural integrity are compromised

Engineering Contradiction:
Improvestructural integrityVSAvoidprocess complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The peripheral rebate is pre-formed on the pressure surface of the punch before the extrusion process begins. This preliminary action ensures that during the single-step extrusion, the first metal material is properly formed into the peripheral side wall with correct structural integrity, avoiding the need for subsequent joining operations that would compromise precision or increase process complexity.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent merges the formation of multiple heat sink components (fins, peripheral side wall, and heat-spreading surface) into a single extrusion process. By integrating these features into one manufacturing step using a specifically designed punch with peripheral rebate, the method achieves high structural integrity without increasing device complexity or process complexity.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method reduces production costs and enhances thermal conductivity and insulation, providing a cost-effective heat sink with improved heat dissipation for semiconductor arrangements.

Implementation Method 1

pressing the first metal material of the semifinished product by means of the punch through the openings of the die so as to form the fins and into the peripheral rebate of the punch so as to form the peripheral side wall

Methodology Applied
Scientific EffectPlasticity: Plasticity

Implementation Method 2

a material layer made of a second metal material, which has a higher thermal conductivity than the first metal material

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS12508643B2Method for producing a heat sink having fins and a peripheral side wall
Publication Date: 2025.12.30 SIEMENS AG
  • US12508643B2 patent drawing
  • US12508643B2 patent drawing
  • US12508643B2 patent drawing

AI summary

In a method for producing a heat sink, a semifinished product of a first metal material is placed into a die and a material layer of a second metal material of a higher thermal conductivity than the first metal material is releasably connected to a pressure surface of a punch. The punch is brought into contact via the material layer with the semifinished product in the die. The heat sink is formed by pressing the first metal material of the semifinished product by the punch through openings of the die fins of the heat sink are formed and into a peripheral rebate of the punch a peripheral side wall of the heat sink, wherein the material layer is connected over its entire surface to the first metal material of the semifinished product. The punch is released from the material layer, and the heat sink is ejected from the die.