Aluminum-Copper Composite Heat Sink for Laser Chip Cooling Stability
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Solution Overview
Problem
Existing radiators for laser chips, made of pure aluminum or copper, suffer from low heat transfer efficiency, material waste, complex structure, high processing costs, vulnerability to cracking, and electrochemical corrosion, leading to poor heat dissipation and short service life.
Innovation Solution
A method of manufacturing an aluminum-copper integrated die-casting composite radiator involves forming a copper inner core and an aluminum outer shell through die-casting, with heat treatments and surface finishing, creating a composite structure that enhances heat dissipation and structural stability, while avoiding material waste and reducing maintenance costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If pure copper material is used for radiator, then heat conduction coefficient is improved (401 W/(m·K)), but yield ratio is reduced (less than 50%) and material waste increases
Solution Approach 1:
The patent applies composite materials by combining copper inner core with aluminum outer shell through die-casting integration. The copper inner core provides excellent heat conduction (401 W/(m·K)) while the aluminum outer shell (205-235 W/(m·K)) provides sufficient heat dissipation surface area. This composite structure optimizes both thermal performance and material utilization, achieving high yield ratio while maintaining effective heat dissipation.
2Loss of substance
If pure aluminum material is used for radiator, then material cost is reduced, but heat conduction coefficient is lowered (205-235 W/(m·K)) resulting in poor heat dissipation effect
Solution Approach 1:
The patent uses a composite material structure where the copper inner core (high heat conduction: 401 W/(m·K)) efficiently conducts heat from the laser chip, while the aluminum outer shell (lower cost, 205-235 W/(m·K)) provides extensive heat dissipation surface area through fins. This combination achieves optimal balance between cost-effectiveness and thermal performance.
3Ease of manufacture
If overall design of single material is used, then manufacturing process is simplified, but structure complexity increases and processing time is extended
Solution Approach 1:
The patent employs composite materials (copper inner core + aluminum outer shell) integrated through die-casting technology. This approach simplifies the manufacturing process by combining two materials into one integrated component, eliminating the need for complex assembly operations. The integrated structure reduces processing time while maintaining design flexibility and structural optimization.
4Ease of manufacture
If single material radiator is processed by machining, then manufacturing is straightforward, but vulnerability to cracking and deformation increases
Solution Approach 1:
The patent utilizes composite materials (copper inner core + aluminum outer shell) that are integrated through die-casting. This composite structure enhances overall structural strength and resistance to cracking and deformation. The combination of copper's ductility and aluminum's strength provides superior mechanical properties compared to single-material radiators, improving reliability under thermal and mechanical stress.
5Adaptability or versatility
If different materials are used for radiator and cooling module, then functional requirements are met, but electrochemical reactions occur causing electrolytic corrosion
Solution Approach 1:
The patent applies homogeneity by using the same material (aluminum) for both the radiator outer shell and the cooling module. This eliminates the electrochemical potential difference between dissimilar metals, preventing galvanic corrosion and electrolytic reactions. The uniform material composition ensures long-term durability while meeting all functional cooling requirements.
6Area of stationary object
If complex structure design is used for radiator, then heat dissipation area is increased, but processing time and costs are elevated
Solution Approach 1:
The patent employs composite materials integrated through die-casting technology, which enables the formation of complex heat dissipation structures (including fins and channels) directly during the casting process. This eliminates the need for time-consuming post-processing operations such as machining or welding, thereby achieving high heat dissipation area without proportionally increasing processing time or costs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composite radiator achieves efficient heat dissipation, high dimensional stability, and long service life, with improved thermal shock resistance and humidity resistance, reducing the risk of cracking and deformation in extreme environments.
Implementation Method 1
the copper inner core and the aluminum outer shell are integrated through die-casting, forming a composite structure that enhances heat dissipation
Implementation Method 2
the copper inner core and the aluminum outer shell are integrated through die-casting
Implementation Method 3
utilizing heat treatment and surface finishing processes
Data Source
Figure 1
Figure 2
Figure 3~5
AI summary
The present invention discloses a composite radiator manufactured by an aluminum-copper integrated die-casting process for a laser chip. In the process, a copper heat dissipation assembly, after being completely manufactured, is stably provided in an anti-gravity cavity mold, and is die-cast with an aluminum material to form a copper-aluminum composite, which is subjected to (T4+T6) heat treatments to be prepared into a composite blank, so as to improve overall use performance of the radiator, such as hardness and size stability, and enable the radiator to maintain high dimensional stability, thermal shock resistance and high temperature and humidity resistance in an extreme environment of -40-280 °C; single T2 copper heat dissipation and heat exchange flow paths are formed, an advanced coolant is used, and in combination with a structure design of a cooling module, an totally-enclosed cooling circulation system is formed, the problems of water electrolysis and microorganism generation of the coolant in use and oxidation or corrosion of the flow paths are solved; an integrated laser pump source structure with a concise structure, efficient cooling, stable dimension, and easy post processing is manufactured; and high-reliability and low-cost requirements are met, and competitiveness of products is enhanced.