Composite Heat Dissipation Substrate for Thermal Expansion Matching
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Solution Overview
Problem
Existing heat dissipation substrates for high-power laser chips suffer from unsatisfactory thermal expansion rate matching, leading to thermal stress and limited heat conduction, affecting performance and lifespan.
Innovation Solution
A multi-layer composite heat dissipation substrate comprising a substrate body, a first insulating layer made of nitride, oxide, or oxynitride, a first electrode layer, a second electrode layer, and a solder layer, with insulating layers between the substrate body and electrode layers, enhancing thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a traditional ceramic substrate is used for heat dissipation, then the structure is simple and easy to manufacture, but the thermal conductivity is limited and thermal expansion rate matching with laser chips is unsatisfactory
Solution Approach 1:
The patent employs a multi-layer composite structure consisting of a ceramic substrate layer, a diamond layer, and a metal layer. Each layer is selected for its specific properties: the ceramic substrate provides mechanical support and ease of manufacture, the diamond layer provides high thermal conductivity and matched thermal expansion coefficient, and the metal layer enhances electrical conductivity and thermal management. This composite structure resolves the contradiction by combining materials with complementary properties to achieve both manufacturability and thermal performance.
2Device complexity
If a traditional ceramic substrate is used for heat dissipation, then the structure is simple, but the heat conduction capability is limited
Solution Approach 1:
The multi-layer composite structure incorporates a diamond layer known for its exceptional thermal conductivity (up to 2000 W/m·K), which is significantly higher than traditional ceramic materials. The diamond layer is strategically positioned between the laser chip and the ceramic substrate to create an efficient heat conduction pathway, thereby resolving the contradiction between structural simplicity and heat conduction capability.
3Device complexity
If the insulating layer is made directly on the substrate without intermediate layers, then the manufacturing process is simpler, but the thermal stress and delamination risk increase
Solution Approach 1:
The patent introduces an intermediate adhesion layer between the ceramic substrate and the diamond layer, and another intermediate layer between the diamond layer and the metal layer. These intermediary layers serve as transition zones that gradually bridge the thermal and mechanical property differences between adjacent layers, reducing thermal stress concentration and preventing delamination. This resolves the contradiction by adding controlled complexity to enhance structural stability.
4Temperature
If high thermal conductivity materials are used throughout the substrate, then heat dissipation is improved, but the thermal expansion coefficient matching with laser chips deteriorates
Solution Approach 1:
The patent applies the principle of local quality by assigning different material properties to different layers based on their specific functional requirements. The diamond layer provides high thermal conductivity where heat dissipation is most critical (near the laser chip), while the ceramic substrate provides matched thermal expansion coefficients for structural stability. This localized optimization resolves the contradiction by allowing each region to have the properties most suitable for its function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves heat dissipation effectiveness and thermal expansion coefficient matching, resulting in superior thermal conductivity compared to ceramic substrates, enhancing the performance and lifespan of high-power chips.
Implementation Method 1
The first insulating layer is made of an insulating material selected from the group consisting of nitride, oxide, and oxynitride
Implementation Method 2
the multi-layer composite heat dissipation substrate provided by the present disclosure has higher thermal conductivity compared with the thermal conductivity of the existing ceramic substrate, such that the heat dissipation effect for high-power chips is improved
Data Source
AI summary
A multi-layer composite heat dissipation substrate includes a substrate body, a first insulation layer, a first electrode layer, a second electrode layer, and a solder layer. The substrate body has a first surface and a second surface. The first insulating layer is formed on the first surface of the substrate body. The first insulating layer is made of an insulating material selected from the group consisting of: nitride, oxide, and oxynitride. The first electrode layer is formed on a top surface of the first insulating layer. The second electrode layer is located below the substrate body. The solder layer is formed on a top surface of the first electrode layer.