Composite Housing Assembly for Rigid Low-Cost Device Frames

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Solution Overview

Problem

The use of metal materials in electronic devices for rigidity and functionality increases production costs due to the need for high-quality surface processing and complex manufacturing operations.

Innovation Solution

A housing assembly structure that incorporates a conductive part and a nonconductive part, with the conductive part being hidden by a nonconductive part and a frame member, eliminating the need for exposed metal surfaces and reducing production complexity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If metal material is used for lateral member to increase stiffness and perform antenna function, then device rigidity and functionality are improved, but production cost increases due to required high-quality surface processing

Engineering Contradiction:

Improvedevice rigidityVSAvoidproduction cost

Core Design Contradiction:

StrengthVSEase of manufacture

Solution Approach 1:

The lateral member is constructed as a composite structure combining a metal conductive part (for stiffness and antenna function) with a non-conductive part (for surface quality and cost reduction). The non-conductive part covers the metal surface that would otherwise require expensive processing, while the metal conductive part maintains structural rigidity and electromagnetic functionality.

Inventive Principle:

Principle #40Composite materials

2Adaptability or versatility

If metal material is used for lateral member to perform antenna function, then device functionality is improved, but manufacturing complexity increases due to required deposition or painting processes

Engineering Contradiction:

Improveantenna functionVSAvoidmanufacturing operations

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent extracts the surface finishing requirement from the metal conductive part by covering it with a non-conductive part. This separation allows the metal component to focus solely on providing antenna function and structural support, while the non-conductive part handles the surface quality aspect, thereby simplifying the overall manufacturing process.

Inventive Principle:

Principle #2Taking out (Extraction)

3Manufacturing precision

If high-quality surface processing is performed on exposed metal material, then appearance quality is improved, but production time and cost increase

Engineering Contradiction:

Improvesurface qualityVSAvoidproduction efficiency

Core Design Contradiction:

Manufacturing precisionVSProductivity

Solution Approach 1:

The non-conductive part acts as a sacrificial or permanent cover that protects the metal conductive part from requiring expensive surface processing. By using this covering approach, the patent achieves acceptable surface quality without investing time and resources in complex metal finishing processes like CNC machining or deposition.

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

Data Source

PatentUS12416947B2Electronic device comprising housing assembly structure

Publication Date: 2025.09.16 SAMSUNG ELECTRONICS CO LTD

AI summary

An electronic device is provided. The electronic device includes: a first plate; a second plate; a lateral member provided around a space between the first plate and the second plate, the lateral member including a conductive part and a nonconductive part; a frame member provided at least partly along a border of the lateral member and at least partially forming a side surface of the electronic device; and a display in the space and facing the first plate. The frame member is coupled with the nonconductive part.