Composite Image Sensor Vertical Layer Alignment

The patent applies dimensionality change by separating photodiode layers for different light waves (visible and infrared) along the vertical dimension rather than placing them in the same plane. By stacking photodiode layers at different depths and adjusting their focal distances, the patent enables multi-light wave sensing while maintaining image quality through three-dimensional spatial arrangement.

The patent implements local quality by optimizing each photodiode layer's position and focal distance according to the specific wavelength characteristics of the light it detects. Each layer is locally adjusted to achieve optimal focus for its designated light wave, with the wiring layer thickness specifically tuned to compensate for focal plane deviations between different light waves.

The patent resolves the focal distance alignment issue by utilizing the vertical dimension for separation while maintaining compact horizontal dimensions. Different photodiode layers are positioned at different vertical depths, allowing each layer to have its own optimized focal distance while keeping the overall device size compact through vertical stacking rather than horizontal expansion.

The patent applies parameter changes by adjusting the wiring layer thickness and photodiode layer positions to optimize focal distances for different light waves. The wiring layer thickness is specifically designed to compensate for the focal plane deviation between visible and infrared light, enabling both light waves to be in focus simultaneously despite their different wavelengths.