Composite Inductor Structure for High-Frequency Low-Loss Switching

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Solution Overview

Problem

Traditional inductor components face challenges in supporting high frequencies due to large metal magnetic powder sizes, leading to increased eddy current loss and difficulty in downsizing, as they require thicker substrates and larger wire pitches to maintain strength and reduce thickness.

Innovation Solution

The inductor component employs a composite body with inorganic fillers of average particle diameters ≤5 μm, allowing for reduced wire pitches and interlayer pitches, and includes magnetic and insulating composite bodies to enhance magnetic permeability and insulation, enabling high-frequency support while maintaining strength and facilitating downsizing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Power

If metal magnetic powder with average particle diameter of 20 to 50 μm is used in the core, then the inductance value is improved, but the eddy current loss increases and high frequency support becomes difficult

Engineering Contradiction:
Improveinductance valueVSAvoideddy current loss
Core Design Contradiction:
PowerVSLoss of energy

Solution Approach 1:

The patent changes the particle diameter parameter of the metal magnetic powder from 20-50 μm to 3-10 μm, which fundamentally alters the eddy current characteristics. This parameter change reduces the eddy current loss while maintaining sufficient inductance value, enabling the inductor to support high-frequency switching operations up to 100 MHz.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent uses a composite material consisting of metal magnetic powder dispersed in an insulating resin matrix. This composite structure provides both the necessary magnetic properties for inductance and the insulating properties that reduce eddy current loss, achieving a balance between power and energy loss.

Inventive Principle:
Principle #40Composite materials

2Volume of moving object

If the thickness of the glass epoxy substrate is reduced to enable downsizing, then the component size is reduced, but the substrate strength decreases and wire processing becomes difficult

Engineering Contradiction:
Improvecomponent thicknessVSAvoidsubstrate strength
Core Design Contradiction:
Volume of moving objectVSStrength

Solution Approach 1:

The patent employs a thin film substrate with thickness of 30 μm or less, which is sufficiently thin for downsizing applications such as mobile devices. The use of advanced thin film technology maintains structural integrity and enables wire processing despite the reduced thickness, achieving both size reduction and functional performance.

Inventive Principle:
Principle #30Flexible shells and thin films

3Volume of moving object

If the wire pitch is reduced to enable downsizing, then the component size is reduced, but the manufacturing precision requirements increase

Engineering Contradiction:
Improvecomponent sizeVSAvoidwire pitch precision
Core Design Contradiction:
Volume of moving objectVSManufacturing precision

Solution Approach 1:

The patent reduces the wire pitch parameter to 10 μm or less, which significantly decreases the component size. This parameter change is accompanied by corresponding adjustments in manufacturing processes to maintain the required precision, enabling miniaturization while ensuring manufacturability.

Inventive Principle:
Principle #35Parameter changes

4Power

If the thickness of the core is increased to improve the L-value, then the inductance value is improved, but the component height increases and downsizing becomes difficult

Engineering Contradiction:
Improveinductance valueVSAvoidcore thickness
Core Design Contradiction:
PowerVSLength of stationary object

Solution Approach 1:

The patent changes the particle diameter parameter of the metal magnetic powder to 3-10 μm, which increases the surface area to volume ratio. This allows for more efficient magnetic flux distribution and higher inductance values to be achieved with thinner core structures, thereby reducing the core thickness to 10 μm or less while maintaining sufficient inductance.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively supports high frequencies with reduced eddy current loss and enables significant downsizing of the inductor component, maintaining strength and achieving necessary inductance values for high-speed switching operations.

Implementation Method 1

Because the size of the metal magnetic powder is large, the eddy current loss is large in the metal magnetic powder and, in the high speed switching operation at a frequency such as 50 MHz to 100 MHz, the loss is large and the high frequency is difficult to be supported

Methodology Applied
Scientific EffectEddy current loss: Eddy Currents

Implementation Method 2

the core is a metal magnetic powder-including resin and the core includes metal magnetic powder whose average particle diameter is 20 to 50 μm

Methodology Applied
Scientific EffectMagnetic permeability: Ferromagnetism

Data Source

PatentUS11876449B2Inductor component, package component, and switching regulator
Publication Date: 2024.01.16 MURATA MFG CO LTD
  • US11876449B2 patent drawing
  • US11876449B2 patent drawing
  • US11876449B2 patent drawing

AI summary

An inductor component includes a composite body that includes a plurality of composite layers each including a composite material of an inorganic filler and a resin; and a plurality of spiral wires that each are stacked on the composite layer, the spiral wires each being covered with the other composite layer. The average particle diameter of the inorganic filler is equal to or smaller than 5 μm, the wire pitch of the spiral wires is equal to or smaller than 10 μm, and the interlayer pitch between adjacent spiral wires is equal to or smaller than 10 μm.