Composite Interconnect Using Carbon Nanotubes for Thermal and Mechanical Stability
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Solution Overview
Problem
Conventional semiconductor fabrication methods face challenges in achieving reliable and efficient interconnects between semiconductor devices and substrates or PCBs, particularly in terms of mechanical stability, interconnect density, and thermal management, often requiring underfilling and additional connectors.
Innovation Solution
A composite interconnect system utilizing carbon nanotubes, solder balls, and standoff balls provides connections between semiconductor devices and substrates or PCBs, eliminating the need for underfilling and additional connectors, while allowing for increased reliability, density, and thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire-bonding or flip-chip technology is used for die-attach, then electrical connection is established, but mechanical stability is reduced and additional underfilling is required
Solution Approach 1:
The patent combines multiple interconnect functions into a single integrated structure. The interconnect provides electrical connection, mechanical support, and thermal management simultaneously, eliminating the need for separate wire-bonding or flip-chip processes and removing the requirement for underfilling material.
Solution Approach 2:
The interconnect utilizes composite material structures that integrate conductive elements for electrical connection with mechanically robust components for structural support. This composite approach enables the single interconnect to fulfill multiple functions that previously required separate components and processes.
2Reliability
If conventional interconnects (PGA, BGA, connectors) are used for PCB-attach, then electrical connection is established, but interconnect density is reduced and package size increases
Solution Approach 1:
The patent transitions from traditional two-dimensional interconnect layouts (PGA, BGA) to a three-dimensional integrated structure. By stacking interconnect layers and utilizing vertical space, the design achieves higher interconnect density without proportionally increasing the package footprint, effectively adding a dimensional aspect to the interconnect architecture.
3Reliability
If conventional interconnects are used, then electrical connection is established, but thermal management is insufficient and additional components are required
Solution Approach 1:
The interconnect is designed as a multi-functional component that simultaneously provides electrical connection, mechanical support, and thermal management. By integrating thermal conduction pathways directly into the interconnect structure, the patent eliminates the need for separate thermal management components while improving overall thermal performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composite interconnect system enhances interconnect reliability, density, and thermal management, enabling smaller package sizes and improved power delivery without the need for underfilling or additional connectors, while accommodating material and positional variations.
Implementation Method 1
A composite interconnect system utilizing carbon nanotubes, solder balls, and standoff balls provides connections between semiconductor devices and substrates or PCBs
Implementation Method 2
The solder bumps are then re-melted to establish an electrical and mechanical connection, typically using an ultrasound process
Implementation Method 3
The solder bumps are then re-melted to establish an electrical and mechanical connection, typically using an ultrasound process
Implementation Method 4
A composite interconnect system utilizing carbon nanotubes, solder balls, and standoff balls provides connections between semiconductor devices and substrates or PCBs
Data Source
AI summary
A composite interconnect system includes a plurality of carbon nanotubes, a plurality of solder balls and standoff balls disposed on a first device to provide a connection to a second device. A die-attached substrate includes a substrate and one or more die disposed on the substrate by a die-attach composite interconnect. The die-attach composite interconnect includes a plurality of carbon nanotubes, solder bumps, and standoff balls disposed on the die to provide one or more connections to the substrate. A PCB-attached substrate package includes a substrate package and one or more die disposed on the substrate package. The substrate package is disposed on a PCB by a PCB-attach composite interconnect. The PCB-attach composite interconnect includes a plurality of carbon nanotubes, solder balls, and standoff balls disposed on the substrate package to provide one or more connections to the PCB.