Composite Interlayer Surface Profile for Package Delamination Resistance
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Solution Overview
Problem
Conventional packages face issues with delamination of constituents, leading to mechanical weak points and reduced reliability due to lack of proper adhesion between the encapsulant and functional package bodies, particularly at the interface where filler particles are absent.
Innovation Solution
A structure comprising a first sub-structure with a surface profile of elevations and recesses that allows filler particles to enter, forming an interlayer with enhanced mechanical properties, improving adhesion and flexural strength by creating a composite interface between the encapsulant and functional package bodies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional flat interface is used between encapsulant and functional package body, then the manufacturing process is simple, but adhesion is poor and delamination occurs
Solution Approach 1:
The interface structure incorporates a porous layer with controlled porosity (30-70%) between the encapsulant and functional package body. This porous structure allows filler particles to penetrate and embed within the pores, creating mechanical interlocking that significantly enhances adhesion and prevents delamination while maintaining manufacturing feasibility.
Solution Approach 2:
The interface structure uses a composite material system consisting of a porous base layer combined with filler particles (such as glass beads, metal particles, or ceramic particles). This composite approach creates a multi-phase structure that provides both mechanical interlocking through the porous network and enhanced bonding through the filler particles embedded in the pores, resolving the adhesion problem without excessive complexity.
2Strength
If filler particles are absent at the interface, then the manufacturing process is simple, but mechanical strength is reduced and cracks form
Solution Approach 1:
The porous layer is pre-formed with controlled pore size and distribution before the encapsulant is applied. This preliminary structure is designed to actively capture and retain filler particles during the encapsulant curing process, ensuring that filler particles are positioned at the interface before any potential crack formation can occur, thereby enhancing flexural strength from the outset.
Solution Approach 2:
The porous layer acts as an intermediary structure between the encapsulant and functional package body, serving as a mediator that captures filler particles and transfers mechanical loads. This intermediate porous layer with embedded filler particles creates a gradient structure that smoothly transitions between the two main components, preventing stress concentration and crack initiation at the interface.
3Temperature
If a uniform material structure is used throughout, then manufacturing is simple, but thermal stress management is poor
Solution Approach 1:
The interface structure implements local quality by creating a porous layer with specific pore size distribution (0.1-10 micrometers) and filler particle concentration only at the critical interface region between encapsulant and functional package body. The bulk materials maintain their original uniform composition, while the localized porous interface structure with embedded filler particles provides tailored thermal expansion characteristics that reduce thermal stress at the bonding interface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly enhances the mechanical integrity and reliability of the package by promoting adhesion and reducing crack formation, preventing delamination and improving thermal stress management through the incorporation of filler particles in the interlayer.
Implementation Method 1
a surface of the first sub-structure has a surface profile with first elevations and first recesses configured for enabling at least part of the filler particles to at least partially enter the first recesses
Data Source
AI summary
A method includes coupling a first sub-structure with a second sub-structure; configuring the second sub-structure as a composite comprising filler particles in a matrix; configuring a surface of the first sub-structure with a surface profile having first elevations and first recesses; at least partially inserting at least part of the filler particles in the first recesses to form an interlayer comprising the first elevations of the first sub-structure and filler particles in the matrix of the second sub-structure; and forming second elevations and second recesses on the first elevations and the first recesses, wherein the second elevations and the second recesses have smaller dimensions than the first elevations and the first recesses, wherein the second recesses are dimensioned to enable at least part of the matrix to at least partially enter the second recesses and are dimensioned to disable the filler particles to enter the second recesses.