Composite Lamination Chuck for Precise Film Alignment
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Solution Overview
Problem
The challenge in semiconductor manufacturing lies in integrating multiple semiconductor devices efficiently while addressing the demands for miniaturization, higher speed, and better electrical performance, particularly in wafer-level packaging processes.
Innovation Solution
A lamination process utilizing a chuck with a soft, elastic top layer and a rigid support layer, featuring vacuum channels for precise alignment and lamination of film materials onto substrates, ensuring smooth surfaces and accurate placement of semiconductor packages.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a rigid chuck is used for lamination, then structural stability is maintained, but surface irregularities increase and lamination precision deteriorates
Solution Approach 1:
The chuck is constructed as a composite structure with a rigid base layer providing structural stability and a soft elastic top layer providing surface conformity. This composite design allows the chuck to maintain overall rigidity while the top surface adapts to substrate irregularities, resolving the contradiction between rigidity and lamination precision.
Solution Approach 2:
Different parts of the chuck have different mechanical properties: the base layer is rigid for structural support while the top layer is soft and elastic for surface adaptation. This local differentiation of material properties allows the chuck to simultaneously provide structural stability and precise lamination contact.
2Manufacturing precision
If a soft top layer is used on the chuck, then lamination smoothness improves, but structural support capability deteriorates
Solution Approach 1:
The multi-layer composite structure combines materials with complementary properties: the rigid base provides structural support while the soft elastic top layer ensures smooth lamination contact. Each layer performs its specialized function, resolving the contradiction between softness for smoothness and rigidity for support.
Solution Approach 2:
The chuck is segmented into multiple functional layers with distinct roles. The base layer handles structural support while the top layer handles surface contact, allowing each segment to be optimized for its specific function without compromise.
3Manufacturing precision
If vacuum channels are added to the chuck, then film material alignment precision improves, but device complexity increases
Solution Approach 1:
Vacuum channels are integrated into the chuck structure to provide pneumatic actuation for film material alignment and securing. This allows precise positioning and holding of the film during lamination through vacuum pressure, improving alignment precision while the channels are designed to minimize structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The process achieves precise lamination with minimal surface irregularities, enhancing the integration of semiconductor devices and improving electrical performance by ensuring smooth outer surfaces and accurate alignment.
Implementation Method 1
Suction may be applied at another end of the channel, so that the suction is transmitted to the dielectric film through the polymeric material
Implementation Method 2
The channel extends through a polymeric material of the chuck. The applied pressure may be transmitted to the dielectric film through the polymeric material
Data Source
AI summary
A lamination chuck for lamination of film materials includes a support layer and a top layer. The top layer is disposed on the support layer. The top layer includes a polymeric material having a Shore A hardness lower than a Shore hardness of a material of the support layer. The top layer and the support layer have at least one vacuum channel formed therethrough, vertically extending from a top surface of the top layer to a bottom surface of the support layer.