Composite Material Layer for Heat Dissipation in Circuit Boards
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current semiconductor structures face challenges in heat dissipation due to limited heat transfer efficiency, particularly in multilayer board structures where vertical heat transfer paths are blocked by other layers, leading to restricted heat dissipation.
Innovation Solution
A package structure incorporating a circuit board with a composite material layer having a thermal conductivity between 450 W/mK and 700 W/mK, where the heat generating element is electrically connected and heat is transferred horizontally through this layer, enhancing heat dissipation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional copper electroplating or copper block embedding is used for heat dissipation, then vertical heat transfer is achieved, but the heat dissipation area is limited and heat transfer efficiency is insufficient
Solution Approach 1:
The patent uses a composite material layer comprising graphene and copper foil, where graphene provides exceptional thermal conductivity (450-700 W/mK) and the copper foil provides structural support and additional heat conduction pathways. This composite structure achieves superior heat dissipation efficiency while maintaining flexibility and expanding heat transfer area compared to conventional single-material approaches.
Solution Approach 2:
The patent transitions from vertical heat transfer through thick copper blocks to horizontal heat spreading through a thin composite material layer integrated within the circuit board structure. This dimensional change allows heat to dissipate across a larger area of the board surface rather than being constrained to vertical pathways, significantly improving heat transfer efficiency.
2Temperature
If metal core layers are used for horizontal heat transfer, then heat conduction is improved, but indirect contact heat transfer through blind holes is required and heat dissipation is limited to board center
Solution Approach 1:
The composite material layer serves multiple functions simultaneously: it acts as a heat dissipation layer for thermal management, provides mechanical reinforcement to the circuit board structure, and can be integrated with existing PCB manufacturing processes. This multi-functionality eliminates the need for separate metal core layers and blind hole structures, reducing overall device complexity.
3Temperature
If vertical heat transfer paths are used in multilayer boards, then heat can be conducted upward, but other circuit layers block the path and contact area with external environment is limited
Solution Approach 1:
The patent segments the heat dissipation function from the vertical stack-up of circuit layers by inserting the composite material layer at a strategic position within the board structure. This segmentation allows heat to be extracted laterally at the composite layer position rather than requiring heat to travel vertically through multiple blocking circuit layers, significantly improving heat dissipation effectiveness and external contact area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The package structure effectively transfers heat generated by the heat generating element to the external environment, achieving better heat dissipation efficiency compared to conventional methods by utilizing a composite material layer with thermal conductivity greater than copper, facilitating faster heat transfer and improved dissipation.
Implementation Method 1
Heat generated by the heat generating element is transferred to the external environment through the composite material layer
Data Source
AI summary
A package structure including a circuit board and a heat generating element is provided. The circuit board includes a plurality of circuit layers and a composite material layer. A thermal conductivity of the composite material layer is between 450 W/mK and 700 W/mK. The heat generating element is disposed on the circuit board and electrically connected to the circuit layers. Heat generated by the heat generating element is transmitted to an external environment through the composite material layer.