Composite LED Package Omnidirectional Light Emission
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Solution Overview
Problem
Conventional LED packages have restricted viewing angles due to packaging materials and configurations, leading to inefficient light emission and higher fabrication costs, with most providing less than 180° viewing angle, whereas a 360° viewing angle is desired for various applications.
Innovation Solution
A composite LED package design featuring a first and second lead frame with a die deposition area and wire bonding, enclosed by an encapsulant that secures the LED die, allowing for broader viewing angles and reduced manufacturing costs through simplified fabrication processes, eliminating the need for costly optical lenses and injection molding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional LED packaging materials and configurations (reflector cup, plastic lens, substrate) are used, then the LED structure is stable and manufacturable, but the viewing angle is restricted to less than 180°
Solution Approach 1:
The patent removes the reflector cup and plastic lens from the packaging structure. Instead of using these traditional components to direct light, the invention exposes the LED chip directly, allowing light to emit in all directions (360° viewing angle) without confinement from reflective or refractive optical elements.
Solution Approach 2:
The lead frame serves multiple functions: it provides electrical connection, mechanical support, and heat dissipation. By integrating these functions into a single component rather than using separate reflector cup, substrate, and lens assemblies, the packaging structure is simplified while maintaining stability and achieving omnidirectional light emission.
2Illumination intensity
If conventional SMD package with substrate, lead frame, and optical lens is used, then electrical connection is reliable, but light is absorbed and reflected multiple times reducing luminance and wasting energy
Solution Approach 1:
The patent removes the optical lens and confines the LED chip within a transparent encapsulant rather than using a traditional SMD structure with substrate and lens. This eliminates multiple internal reflections and absorption events that occur in conventional packages, allowing light to escape directly with higher intensity and reduced energy loss.
Solution Approach 2:
A transparent encapsulant is introduced as an intermediary material that protects the LED chip while being optically transparent. Unlike the opaque or semi-transparent substrate and lens in conventional packages, this encapsulant allows light to pass through without significant absorption or scattering, maintaining high luminance and efficient light extraction.
3Ease of manufacture
If conventional SMD package with metal pressing and plastic injection molding is used, then the packaging is durable, but the fabrication cost is high
Solution Approach 1:
The patent eliminates the complex multi-step manufacturing process of conventional SMD packages by removing the substrate injection molding and separate lens assembly steps. The simplified structure using lead frame and encapsulant can be manufactured with fewer process steps, reducing fabrication cost while maintaining packaging integrity and durability.
Solution Approach 2:
The patent combines the substrate and lens functions into a single encapsulant component that is molded directly over the LED chip mounted on the lead frame. This integration eliminates the need for separate manufacturing steps for substrate and lens, simplifying the production process and reducing overall fabrication cost while maintaining structural reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composite LED package achieves a wider viewing angle and reduced manufacturing costs by using a lead frame and encapsulant configuration that enhances light emission directionality and eliminates the need for optical lenses, resulting in a more cost-effective and efficient lighting solution.
Implementation Method 1
The encapsulant encloses the top faces of the first and second lead frames and the bottom faces of the first and second lead frames to encapsulate the LED die
Implementation Method 2
The encapsulant is attached to the first adhesion area of the first lead frame
Implementation Method 3
At least one of the wires is bonded with the at least one LED die
Data Source
AI summary
A light emitting diode package includes a first lead frame, a second lead frame and an encapsulant. The first lead frame has a die deposition area on the top thereof for disposing LED die. The second lead frame has a contacting face on the top thereof for wire bonding. The die deposition area of the first lead frame has a first adhesion area such that the encapsulant is held by the first adhesion area when enclosing the top and bottom of the first and second lead frames. The light is emitted in all directions.