Composite Container Lid IC Tag Integration
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Solution Overview
Problem
Existing container lid systems with IC tags face challenges in easy attachment, reliable unsealing, and post-unsealing information retrieval, as the IC tag is often broken during capping or requires cumbersome operations, and existing solutions complicate the unsealing process and do not allow for accurate proof of unsealing history.
Innovation Solution
A composite container lid design where the IC tag is integrated into a unitary cap structure, with an over-cap and inner cap that allows for seamless attachment and unsealing without breaking the IC tag, enabling the IC tag's circuit to be broken during unsealing, allowing for reliable indication of unsealing and post-unsealing information retrieval.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the IC tag is provided in the container body and the antenna and lead wire are provided in the cap, then the IC chip can be connected to the antenna, but the cap must be fitted in a state where the IC chip is hanging down requiring very cumbersome operation and the IC chip and lead wire are liable to be broken
Solution Approach 1:
The patent combines the IC chip, antenna, and lead wire into a single integrated IC tag unit that is attached to the cap as one piece. This eliminates the need to handle hanging IC chips separately during capping operations, making the process simpler and reducing the risk of breaking the IC chip or lead wire.
Solution Approach 2:
The IC tag is pre-assembled with the IC chip, antenna, and lead wire connected before the capping operation. This preliminary assembly ensures that all components are properly positioned and connected, eliminating the need for complex manual assembly during the capping process and preventing damage to fragile components.
2Reliability
If the IC chip is provided on the tamper evidence band that will be separated away from the cap when it is opened, then the TE band can be separated to prove unsealing, but it is difficult to fit the IC chip on the TE band and the breakage of the IC tag cannot sufficiently prove the fact of unsealing
Solution Approach 1:
The patent integrates the IC tag directly onto the cap structure rather than placing it on the separable tamper evidence band. This integration ensures that the IC tag remains with the cap during unsealing, and its breakage or damage provides reliable proof that the cap itself was compromised, not just the TE band.
Solution Approach 2:
The patent uses the cap structure as an intermediary carrier for the IC tag, positioning it so that the IC tag is broken during the unsealing process itself. This provides direct evidence that the sealing mechanism was violated, rather than relying solely on TE band separation which could occur without actual unsealing.
3Reliability
If the IC tag is provided on a lid member that is separate from the lid member sealing the container mouth portion, then the IC tag can be broken separately, but the lid member sealing the container mouth portion must be unsealed quite separately requiring clumsy operation
Solution Approach 1:
The patent merges the IC tag provisionally attached to the cap with the final cap structure, so that breaking the IC tag and unsealing the container happen as one integrated operation. The IC tag is positioned such that when the cap is removed from the container, the IC tag is broken, providing unsealing evidence without requiring separate actions.
4Ease of manufacture
If the IC tag is attached to a cap structure, then the IC tag can be easily attached, but the IC tag may be broken during the capping operation
Solution Approach 1:
The IC tag is pre-positioned and secured to the cap structure in a location that avoids stress concentrations and potential breakage points during the capping operation. This preliminary positioning ensures the IC tag remains intact during assembly while maintaining easy attachment.
Solution Approach 2:
The patent positions the IC tag in a specific location on the cap where it is less likely to be damaged during capping operations. The local structural characteristics at this position provide protection to the IC tag while maintaining the overall functionality of the cap.
Data Source
AI summary
A composite container lid which includes an inner cap fitted onto the container mouth portion by screw engagement, an over-cap fitted onto the inner cap, and an IC tag. The over-cap has a top panel and a skirt descending from the circumferential edge of the top panel. The inner cap has a top plate and a cylindrical wall descending from the circumferential edge of the top plate and has a thread formed in the inner surface thereof to come into screw engagement with the outer surface of the container mouth portion. An engaging means is provided between the inner surface of the skirt of the over-cap and the outer surface of the cylindrical wall of the inner cap to transmit the turn of the over-cap fitted onto the inner cap to the inner cap.