Composite Material Bonding with PE-CVD Organosilicon Layers
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Solution Overview
Problem
Existing composite materials face challenges in achieving a stable and permanent bond between materials with significantly different physical and chemical properties, particularly between metals and elastomers or different plastics, due to inadequate adhesion and residual stress in diamond-like carbon (DLC) layers, and lacquers being unsuitable as sealing materials.
Innovation Solution
A composite material comprising a substrate layer and a polymer layer bonded directly by an adhesion promoter layer obtained through plasma-enhanced chemical vapor deposition (PE-CVD) using an organosilicon compound, with the polymer layer having a Shore hardness of 60 to 95 Shore A, ensuring a covalent bond without additional binders.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If DLC adhesion promoter layers are used to bond metal substrates to plastics, then adhesion promotion is achieved, but the bond strength is insufficient and layer stability deteriorates due to high residual stress
Solution Approach 1:
The patent changes the chemical composition parameters of the adhesion promoter layer by using organosilicon compounds instead of pure carbon DLC. This compositional parameter change enables the layer to bond strongly to both metal substrates and polymer coatings while reducing residual stress, thereby simultaneously improving adhesion strength and layer stability.
Solution Approach 2:
The patent creates a composite adhesion promoter layer containing organosilicon compounds that combine the benefits of strong substrate adhesion and reduced residual stress. This composite approach allows the layer to function as both a bonding agent and a stress-reducing intermediary between dissimilar materials.
2Strength
If lacquer coatings are applied as adhesion promoters, then bonding is achieved, but the layer thickness is insufficient and hardness makes them unsuitable as sealing materials
Solution Approach 1:
The patent changes the material parameters by using organosilicon-based plasma coatings instead of lacquer coatings. This enables achieving sufficient layer thickness and appropriate hardness while maintaining bonding strength, thereby making the coating suitable for sealing applications.
3Strength
If wet-chemical binders are applied to create adhesion promoter layers, then bonding is achieved, but the process complexity increases and manufacturing efficiency deteriorates
Solution Approach 1:
The patent replaces wet-chemical bonding processes with plasma-enhanced chemical vapor deposition. This substitution eliminates the need for separate binder application steps and achieves bonding during the coating deposition process itself, significantly improving manufacturing efficiency.
Solution Approach 2:
The patent combines the adhesion promotion function with the coating deposition function into a single plasma processing step. This merging of operations eliminates multiple process steps and improves manufacturing efficiency while maintaining bonding capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a highly stable bond between diverse materials, allowing for a form-fitting connection to be unnecessary, enhancing product design freedom and improving layer stability and adhesion, especially with metals and elastomers.
Implementation Method 1
an adhesion promoter layer which is obtainable by plasma-enhanced chemical vapor deposition (PE-CVD), in which a precursor material containing at least one organosilicon compound is used at least in part
Data Source
AI summary
The invention relates to a composite material comprising a substrate layer and a polymer layer, wherein the polymer layer and substrate layer are directly bonded to one another by an adhesion promoter layer, and wherein the adhesion promoter layer is obtainable by plasma-enhanced chemical vapor deposition (PE-CVD), in which a precursor material containing at least one organosilicon compound is used at least in part, wherein the polymer layer has a Shore hardness, measured according to DIN ISO 7619-1: 2021-02, Shore A, 23 °C, of 60 to 95 Shore A. The invention also relates to processes for producing such composite materials, sealing articles and uses.