Composite Material Thermal Conductivity Degradation
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Solution Overview
Problem
Heat dissipation materials with high thermal conductivity and low thermal expansion coefficients used in semiconductor devices degrade rapidly when subjected to thermal cycles, failing to maintain original thermal conductivity performance.
Innovation Solution
A composite material with a metal matrix (Cu, Ag, Al, or Mg) and thermally conductive particles (diamond or SiC) is developed, where the particles are dispersed at a volume ratio of 15% to 80% and spaced at least 200 μm apart, maintaining a thermal conductivity degradation rate of 5% or less after heating, and featuring a large and small particle size difference with specific spacing to enhance thermal stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If thermally conductive particles (diamond or SiC) are dispersed in a metal matrix to increase thermal conductivity, then thermal conductivity is improved, but thermal conductivity deteriorates when heated to high temperature
Solution Approach 1:
The invention changes the physical parameters of the composite material by controlling particle size (50-500 μm), volume ratio (15-80%), and spacing (200 μm or greater). These parameter changes optimize the balance between thermal conductivity and high-temperature stability, preventing oxidation while maintaining heat dissipation performance
Solution Approach 2:
The invention uses composite materials combining metal matrices (Cu, Ag, Al, Mg) with thermally conductive particles (diamond or SiC). This composite structure leverages the high thermal conductivity of particles while the metal matrix provides structural stability and oxidation resistance at elevated temperatures
2Temperature
If the volume ratio of thermally conductive particles is increased to improve thermal conductivity, then thermal conductivity increases, but the composite material becomes more susceptible to thermal conductivity degradation during thermal cycles
Solution Approach 1:
The invention optimizes the volume ratio parameter to 15-80% and particle spacing to 200 μm or greater. This specific parameter range prevents particle aggregation and maintains stable thermal conductivity during thermal cycling, avoiding the degradation that occurs with higher particle concentrations
Solution Approach 2:
The invention creates local quality differences by ensuring adequate spacing (200 μm or greater) between particles. This spacing creates buffer zones that prevent thermal stress concentration and oxidation propagation, maintaining uniform thermal conductivity throughout the composite material during thermal cycles
3Temperature
If thermally conductive particles are closely spaced to improve heat dissipation efficiency, then thermal conductivity increases, but oxidation occurs more readily during heating
Solution Approach 1:
The invention sets the particle spacing parameter to 200 μm or greater, which is sufficient to prevent oxidation while maintaining effective heat dissipation. This spacing creates a protective effect where the metal matrix isolates particles from oxidative environments during heating
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composite material effectively prevents rapid degradation of thermal conductivity during repeated thermal cycles, ensuring reliable heat dissipation properties and matching thermal expansion coefficients with semiconductor devices.
Implementation Method 1
particles having excellent thermal conductivity such as diamond or silicon carbide (SiC) are dispersed and composited in a metal matrix
Implementation Method 2
a heat dissipation part is required to have high thermal conductivity and a small difference in thermal expansion coefficient with the semiconductor device
Data Source
AI summary
A composite material and a heat dissipation part composed of the composite material are provided. More particularly, a composite material comprising a metal matrix and a structure in which thermally conductive particles are dispersed inside the metal matrix is provided, wherein: the metal matrix is composed of Cu, Ag, Al, Mg, or an alloy thereof; the thermally conductive particles include diamond or SiC; the thermally conductive particles are included at a volume ratio of 15% to 80%; in a microstructure of the composite material, the distance between the center of any one thermally conductive particle and the center of a thermally conductive particle most adjacent to the any one thermally conductive particle is 200 μm or greater; and the any one thermally conductive particle and the thermally conductive particle most adjacent thereto are not in contact with each other but have a metal matrix therebetween.