Composite Micro-Inductor Layered Assembly for Adjustable Inductance
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Solution Overview
Problem
Conventional inductor manufacturing methods face challenges in miniaturization and flexibility in adjusting core and coil configurations to achieve desired inductance values, requiring separate manufacturing processes for different inductance requirements.
Innovation Solution
A manufacturing method for composite-type micro-inductors involves separately producing substrates for magnetic cores and coils, allowing for flexible combination and integration through semiconductor technology, using carrier board and molding processes to form miniaturized inductors with adjustable inductance values.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the number of turns in the wire is increased to improve inductance value, then the inductance value is improved, but the volume of the inductor increases
Solution Approach 1:
The inductor is divided into multiple separate layers: magnetic core layers and coil circuit layers are manufactured independently and then stacked together. This segmentation allows the coil to be wound around the magnetic core in a compact configuration, achieving high inductance values without proportionally increasing the overall volume of the inductor component.
2Adaptability or versatility
If separate manufacturing processes are used for different inductance values, then customization is achieved, but device complexity and manufacturing efficiency deteriorate
Solution Approach 1:
The patent creates universal templates for magnetic core layers and coil circuit layers that can be reused across different inductance requirements. By standardizing the layer structures and using consistent manufacturing processes for these templates, the system achieves adaptability for various inductance values while avoiding the need to create entirely separate manufacturing processes for each specification.
Solution Approach 2:
The patent combines the manufacturing of magnetic core layers and coil circuit layers into a unified lamination process. Both types of layers are manufactured using similar screen printing and lamination techniques, then stacked together in a single assembly process. This merging of manufacturing approaches simplifies the overall production system while maintaining the ability to produce different inductance values by adjusting the number of coil layers or their configuration.
Data Source
AI summary
The present invention discloses a manufacturing method of a composite-type micro-inductor, including following steps. A first step involves providing a first substrate, which includes a first dielectric layer and a magnetic assembly. The magnetic assembly is disposed on the first dielectric layer. A second step involves providing a second substrate, which includes a second dielectric layer, a patterned circuit layer, and an opening. The patterned circuit layer is stacked in a plurality of layers, and the opening penetrate the second dielectric layer. At least a part of the patterned circuit layer is embedded in the second dielectric layer. A third step involves placing the second substrate on the first substrate by threading the magnetic assembly through the opening. A fourth step involves covering the first substrate and the second substrate with a third dielectric layer, and finally forming the composite-type micro-inductor.