Composite Module Sub-Substrate High-Density Mounting
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Solution Overview
Problem
Existing composite modules face a challenge in achieving high-density component mounting without increasing the module size, as the number of via-hole conductors needed grows with the number of surface mount devices, leading to a trade-off between high-density mounting and size reduction.
Innovation Solution
The introduction of a sub-substrate with terminal electrodes that are connected directly to the main substrate, allowing for an increase in the number of terminal electrodes without expanding the main substrate's size, enabling high-density component mounting without size increase.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the number of via-hole conductors is increased to support more surface mount devices, then the number of components that can be mounted increases, but the area of the multilayer circuit board and the size of the composite module must be increased
Solution Approach 1:
The patent introduces a sub-substrate layer between the main substrate and the sealing layer, creating an additional dimensional level for terminal electrode arrangement. This allows terminal electrodes to be distributed across multiple layers (main substrate and sub-substrate) rather than being confined to a single plane, effectively increasing component capacity without expanding the board's footprint area.
Solution Approach 2:
The patent divides the terminal electrode functionality into two separate substrates: the main substrate and the sub-substrate. By segmenting the terminal electrode arrangement across these two layers, the system can support more components through additional via-hole conductors without requiring a larger overall board area, as the electrodes are distributed vertically rather than horizontally.
2Quantity of substance
If the number of terminal electrodes is increased to support high-density component mounting, then more components can be mounted, but the size of the main substrate must be increased
Solution Approach 1:
The patent utilizes the vertical dimension by introducing a sub-substrate layer beneath the main substrate. Terminal electrodes are arranged on both the main substrate and the sub-substrate, allowing the system to increase the total number of terminal electrodes without expanding the horizontal area of the main substrate. This multi-layer electrode arrangement effectively distributes the electrode count across vertical space rather than horizontal space.
Data Source
AI summary
A composite module is obtained which enables high-density mounting of components without increasing its size. A composite module includes a main substrate which is a multilayer circuit board, a sub-substrate mounted on a lower surface of the main substrate, a sealing layer arranged on the lower surface of the main substrate to cover the sub-substrate, the sealing layer defining a mount surface arranged to be mounted on a mount board, and terminal electrodes disposed on the mount surface. The terminal electrodes include at least one first terminal electrode drawn directly from the main substrate and at least one second terminal electrode drawn directly from the sub-substrate.