Composite Module Wiring for RF Isolation
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Solution Overview
Problem
In mobile communication terminals, the close proximity of high-frequency circuit components on composite modules leads to degraded isolation characteristics and signal interference between communication systems, making it challenging to maintain communication quality and size reduction.
Innovation Solution
The configuration of wiring electrodes forming non-simultaneous signal paths in adjacent regions on the circuit board allows for improved isolation without using ground electrodes, enabling precise impedance adjustment and increased design freedom by forming these electrodes on the main surface using techniques like photolithography.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If high-frequency circuit components are disposed in close proximity to reduce terminal size, then device miniaturization is achieved, but isolation characteristics between communication systems and signal paths degrade
Solution Approach 1:
The patent divides the circuit board into multiple regions and segments signal paths spatially. By separating transmission paths and reception paths into different regions, the patent achieves signal isolation without requiring ground electrodes between adjacent wiring electrodes, thus maintaining isolation characteristics while enabling compact terminal design.
Solution Approach 2:
The patent applies different configurations to different regions of the circuit board. Specifically, wiring electrodes for transmission paths are disposed in one region while wiring electrodes for reception paths are disposed in another region, creating local quality differences that prevent signal interference while maximizing space utilization.
2Object-affected harmful factors
If wiring electrodes for signal paths are disposed adjacent to each other to improve isolation characteristics, then isolation between communication systems improves, but design freedom and impedance adjustment capability are reduced
Solution Approach 1:
The patent transitions from two-dimensional planar arrangement to three-dimensional spatial arrangement by utilizing different layers and regions of the circuit board. This dimensional approach allows wiring electrodes to be disposed adjacently in the planar view while maintaining isolation through spatial separation in the three-dimensional structure, thereby preserving both isolation characteristics and design freedom.
Solution Approach 2:
The patent creates a universal wiring electrode configuration that serves multiple functions: adjacent disposal provides isolation characteristics, while the flexible regional arrangement maintains design freedom and impedance adjustment capability. This multi-functional approach eliminates the need for ground electrodes while achieving signal isolation.
3Object-affected harmful factors
If through-hole electrodes connected to ground electrodes are provided to prevent signal interference, then isolation characteristics improve, but device complexity and manufacturing complexity increase
Solution Approach 1:
The patent extracts and eliminates the ground electrode structure from the design. By disposing transmission path wiring electrodes and reception path wiring electrodes in separate regions without requiring ground electrodes between them, the patent removes the complex through-hole electrode structure while maintaining signal isolation through spatial separation.
Solution Approach 2:
The patent enables the wiring electrode configuration itself to provide signal isolation functionality. By strategically disposing transmission and reception path wiring electrodes in different regions, the structure serves its own isolation function without requiring additional ground electrode elements, thereby reducing device complexity.
4Productivity
If RF signals are allowed to pass through adjacent signal paths simultaneously, then communication efficiency improves, but signal interference between paths occurs
Solution Approach 1:
The patent segments signal paths into transmission paths and reception paths disposed in different regions. This spatial segmentation ensures that even when multiple signals are transmitted simultaneously, they do not interfere with each other because they occupy separate spatial domains, thereby maintaining both communication efficiency and signal integrity.
Solution Approach 2:
The patent creates different local environments for transmission and reception signals by disposing them in separate regions. This local quality differentiation allows simultaneous signal transmission without interference, as each signal path experiences a distinct electromagnetic environment that prevents cross-talk.
Data Source
AI summary
Provided is a technique capable of improving isolation characteristics between a plurality of signal paths through which RF signals pass, without using ground electrodes or the like. Wiring electrodes 10a and 20a through which RF signals do not pass simultaneously are formed so as to be adjacent to each other in a central region of a component mounting surface 2a of a circuit board 2, and wiring electrodes 11a and 21a through which RF signals pass simultaneously are formed so as to be distanced from transmission paths 10 and 20. Accordingly, the RF signals do not simultaneously pass through the transmission paths 10 and 20, which are disposed near each other, and thus there is no risk that the RF signal passing through one of the signal paths will interfere with the RF signal passing through the other signal path.